Deposition of Super-Hydrophobic Silver Film on Copper Substrate and Evaluation of Its Corrosion Properties

A simple and versatile chemical solution deposition process is reported to manipulate the wettability properties of copper sheets. The whole process has the advantage of being time-saving low cost and environment-friendly. An adherent silver coating was achieved under optimal conditions. Scanning el...

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Autores principales:	Fani Stergioudi, Aikaterini Baxevani, Azarias Mavropoulos, Georgios Skordaris
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	superhydrophobic deposition process corrosion properties copper equivalent circuit modeling Engineering (General). Civil engineering (General) TA1-2040
Acceso en línea:	https://doaj.org/article/5a5e34e3402740628aecadaa698b1a7c
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spelling	oai:doaj.org-article:5a5e34e3402740628aecadaa698b1a7c2021-11-25T17:15:45ZDeposition of Super-Hydrophobic Silver Film on Copper Substrate and Evaluation of Its Corrosion Properties10.3390/coatings111112992079-6412https://doaj.org/article/5a5e34e3402740628aecadaa698b1a7c2021-10-01T00:00:00Zhttps://www.mdpi.com/2079-6412/11/11/1299https://doaj.org/toc/2079-6412A simple and versatile chemical solution deposition process is reported to manipulate the wettability properties of copper sheets. The whole process has the advantage of being time-saving low cost and environment-friendly. An adherent silver coating was achieved under optimal conditions. Scanning electron microscopy and X-ray diffraction were used to examine the silver film structure. A confocal microscope was used to record the 3D topography and assess the film roughness of the surface. A dual morphology was revealed, consisting of broad regions with feather-like structured morphologies and some areas with spherical morphologies. Such silver-coated copper samples exhibited a sufficiently stable coating with superhydrophobicity, having a maximum water contact angle of 152°, along with an oleophilic nature. The corrosion behavior of the produced hydrophobic copper under optimal conditions was evaluated by means of potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) using a 3.5% NaCl solution. The corrosion protection mechanism was elucidated by the proposed equivalent circuits, indicating that the superhydrophobic silver coating acted as an effective barrier, separating the Cu substrate from the corrosive solution. The superhydrophobic coating demonstrated enhanced anti-corrosion properties against NaCl aqueous solution in relation to the copper substrate as indicated from both EIS and potentiodynamic polarization experiments.Fani StergioudiAikaterini BaxevaniAzarias MavropoulosGeorgios SkordarisMDPI AGarticlesuperhydrophobicdeposition processcorrosion propertiescopperequivalent circuit modelingEngineering (General). Civil engineering (General)TA1-2040ENCoatings, Vol 11, Iss 1299, p 1299 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	superhydrophobic deposition process corrosion properties copper equivalent circuit modeling Engineering (General). Civil engineering (General) TA1-2040
spellingShingle	superhydrophobic deposition process corrosion properties copper equivalent circuit modeling Engineering (General). Civil engineering (General) TA1-2040 Fani Stergioudi Aikaterini Baxevani Azarias Mavropoulos Georgios Skordaris Deposition of Super-Hydrophobic Silver Film on Copper Substrate and Evaluation of Its Corrosion Properties
description	A simple and versatile chemical solution deposition process is reported to manipulate the wettability properties of copper sheets. The whole process has the advantage of being time-saving low cost and environment-friendly. An adherent silver coating was achieved under optimal conditions. Scanning electron microscopy and X-ray diffraction were used to examine the silver film structure. A confocal microscope was used to record the 3D topography and assess the film roughness of the surface. A dual morphology was revealed, consisting of broad regions with feather-like structured morphologies and some areas with spherical morphologies. Such silver-coated copper samples exhibited a sufficiently stable coating with superhydrophobicity, having a maximum water contact angle of 152°, along with an oleophilic nature. The corrosion behavior of the produced hydrophobic copper under optimal conditions was evaluated by means of potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) using a 3.5% NaCl solution. The corrosion protection mechanism was elucidated by the proposed equivalent circuits, indicating that the superhydrophobic silver coating acted as an effective barrier, separating the Cu substrate from the corrosive solution. The superhydrophobic coating demonstrated enhanced anti-corrosion properties against NaCl aqueous solution in relation to the copper substrate as indicated from both EIS and potentiodynamic polarization experiments.
format	article
author	Fani Stergioudi Aikaterini Baxevani Azarias Mavropoulos Georgios Skordaris
author_facet	Fani Stergioudi Aikaterini Baxevani Azarias Mavropoulos Georgios Skordaris
author_sort	Fani Stergioudi
title	Deposition of Super-Hydrophobic Silver Film on Copper Substrate and Evaluation of Its Corrosion Properties
title_short	Deposition of Super-Hydrophobic Silver Film on Copper Substrate and Evaluation of Its Corrosion Properties
title_full	Deposition of Super-Hydrophobic Silver Film on Copper Substrate and Evaluation of Its Corrosion Properties
title_fullStr	Deposition of Super-Hydrophobic Silver Film on Copper Substrate and Evaluation of Its Corrosion Properties
title_full_unstemmed	Deposition of Super-Hydrophobic Silver Film on Copper Substrate and Evaluation of Its Corrosion Properties
title_sort	deposition of super-hydrophobic silver film on copper substrate and evaluation of its corrosion properties
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/5a5e34e3402740628aecadaa698b1a7c
work_keys_str_mv	AT fanistergioudi depositionofsuperhydrophobicsilverfilmoncoppersubstrateandevaluationofitscorrosionproperties AT aikaterinibaxevani depositionofsuperhydrophobicsilverfilmoncoppersubstrateandevaluationofitscorrosionproperties AT azariasmavropoulos depositionofsuperhydrophobicsilverfilmoncoppersubstrateandevaluationofitscorrosionproperties AT georgiosskordaris depositionofsuperhydrophobicsilverfilmoncoppersubstrateandevaluationofitscorrosionproperties
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Deposition of Super-Hydrophobic Silver Film on Copper Substrate and Evaluation of Its Corrosion Properties

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