Cita APA (7a ed.)

Zhang, Z., Wen, Z., Shi, H., Song, Q., Xu, Z., Li, M., . . . Zhang, Z. (2021). Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer. MDPI AG.

Cita Chicago Style (17a ed.)

Zhang, Zhe, Zhidong Wen, Haiyan Shi, Qi Song, Ziye Xu, Man Li, Yu Hou, y Zichen Zhang. Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer. MDPI AG, 2021.

Cita MLA (8a ed.)

Zhang, Zhe, et al. Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer. MDPI AG, 2021.