Ni-Mn-Sn-Cu Alloys after Thermal Cycling: Thermal and Magnetic Response
Heusler Ni-Mn-Sn-based alloys are good candidates for magnetic refrigeration. This application is based on cycling processes. In this work, thermal cycles (100) have been performed in three ribbons produced by melt-spinning to check the thermal stability and the magnetic response. After cycling, the...
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2021
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oai:doaj.org-article:5e39aa9fe7a849b1a0234f9104c4c2d82021-11-25T18:14:07ZNi-Mn-Sn-Cu Alloys after Thermal Cycling: Thermal and Magnetic Response10.3390/ma142268511996-1944https://doaj.org/article/5e39aa9fe7a849b1a0234f9104c4c2d82021-11-01T00:00:00Zhttps://www.mdpi.com/1996-1944/14/22/6851https://doaj.org/toc/1996-1944Heusler Ni-Mn-Sn-based alloys are good candidates for magnetic refrigeration. This application is based on cycling processes. In this work, thermal cycles (100) have been performed in three ribbons produced by melt-spinning to check the thermal stability and the magnetic response. After cycling, the temperatures were slowly shifted and the thermodynamic properties were reduced, the entropy changed at about 3–5%. Likewise, the thermomagnetic response remains similar. Thus, these candidates maintain enough thermal stability and magnetic response after cycling. Likewise, Cu addition shifts the structural transformation to higher temperatures, whereas the Curie temperature is always near 310 K. Regarding magnetic shape memory applications, the best candidate is the Ni<sub>49</sub>Mn<sub>36</sub> Sn<sub>14</sub>Cu<sub>1</sub> alloy.Asma WederniMihail IpatovJulián-María GonzálezMohamed KhitouniJoan-Josep SuñolMDPI AGarticleHeuslerthermal cyclingthermal analysismagnetic behaviorTechnologyTElectrical engineering. Electronics. Nuclear engineeringTK1-9971Engineering (General). Civil engineering (General)TA1-2040MicroscopyQH201-278.5Descriptive and experimental mechanicsQC120-168.85ENMaterials, Vol 14, Iss 6851, p 6851 (2021) |
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Heusler thermal cycling thermal analysis magnetic behavior Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85 |
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Heusler thermal cycling thermal analysis magnetic behavior Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85 Asma Wederni Mihail Ipatov Julián-María González Mohamed Khitouni Joan-Josep Suñol Ni-Mn-Sn-Cu Alloys after Thermal Cycling: Thermal and Magnetic Response |
description |
Heusler Ni-Mn-Sn-based alloys are good candidates for magnetic refrigeration. This application is based on cycling processes. In this work, thermal cycles (100) have been performed in three ribbons produced by melt-spinning to check the thermal stability and the magnetic response. After cycling, the temperatures were slowly shifted and the thermodynamic properties were reduced, the entropy changed at about 3–5%. Likewise, the thermomagnetic response remains similar. Thus, these candidates maintain enough thermal stability and magnetic response after cycling. Likewise, Cu addition shifts the structural transformation to higher temperatures, whereas the Curie temperature is always near 310 K. Regarding magnetic shape memory applications, the best candidate is the Ni<sub>49</sub>Mn<sub>36</sub> Sn<sub>14</sub>Cu<sub>1</sub> alloy. |
format |
article |
author |
Asma Wederni Mihail Ipatov Julián-María González Mohamed Khitouni Joan-Josep Suñol |
author_facet |
Asma Wederni Mihail Ipatov Julián-María González Mohamed Khitouni Joan-Josep Suñol |
author_sort |
Asma Wederni |
title |
Ni-Mn-Sn-Cu Alloys after Thermal Cycling: Thermal and Magnetic Response |
title_short |
Ni-Mn-Sn-Cu Alloys after Thermal Cycling: Thermal and Magnetic Response |
title_full |
Ni-Mn-Sn-Cu Alloys after Thermal Cycling: Thermal and Magnetic Response |
title_fullStr |
Ni-Mn-Sn-Cu Alloys after Thermal Cycling: Thermal and Magnetic Response |
title_full_unstemmed |
Ni-Mn-Sn-Cu Alloys after Thermal Cycling: Thermal and Magnetic Response |
title_sort |
ni-mn-sn-cu alloys after thermal cycling: thermal and magnetic response |
publisher |
MDPI AG |
publishDate |
2021 |
url |
https://doaj.org/article/5e39aa9fe7a849b1a0234f9104c4c2d8 |
work_keys_str_mv |
AT asmawederni nimnsncualloysafterthermalcyclingthermalandmagneticresponse AT mihailipatov nimnsncualloysafterthermalcyclingthermalandmagneticresponse AT julianmariagonzalez nimnsncualloysafterthermalcyclingthermalandmagneticresponse AT mohamedkhitouni nimnsncualloysafterthermalcyclingthermalandmagneticresponse AT joanjosepsunol nimnsncualloysafterthermalcyclingthermalandmagneticresponse |
_version_ |
1718411439903866880 |