Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing

The new composite solder Sn-5Zn-10Bi-10In-<i>x</i>Cr (<i>x</i>=0%, 0.1%, 0.3%, 0.5%, mass fraction) was made by adding different contents of nano-Cr particles to the Sn-Zn-Bi-In solder. The effect of nano-Cr particles on the microstructure, element distribution, phase composi...

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Autores principales:	LIU Guang-zhu, YUE Di, KANG Yu, XIE Hong-yu, HE Ding-jin
Formato:	article
Lenguaje:	ZH
Publicado:	Journal of Materials Engineering 2021
Materias:	lead-free solder wettability imcs aging shear strength Materials of engineering and construction. Mechanics of materials TA401-492
Acceso en línea:	https://doaj.org/article/60a3c3ffabbd4b80852fabe08c4405fc
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spelling	oai:doaj.org-article:60a3c3ffabbd4b80852fabe08c4405fc2021-11-12T03:01:54ZEffect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing1001-438110.11868/j.issn.1001-4381.2021.000247https://doaj.org/article/60a3c3ffabbd4b80852fabe08c4405fc2021-11-01T00:00:00Zhttp://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2021.000247https://doaj.org/toc/1001-4381The new composite solder Sn-5Zn-10Bi-10In-<i>x</i>Cr (<i>x</i>=0%, 0.1%, 0.3%, 0.5%, mass fraction) was made by adding different contents of nano-Cr particles to the Sn-Zn-Bi-In solder. The effect of nano-Cr particles on the microstructure, element distribution, phase composition and mechanical properties of brazing joints before and after aging was studied. The results show that the addition of nano-Cr particles can inhibit the growth of intermetallic compounds (IMCs) in the solder joints. With the increase of the content of nano-Cr particles, the thickness of the IMCs diffusion layer is gradually decreased; the IMCs diffusion layer at the interface near the base material Cu is Cu<sub>5</sub>Zn<sub>8</sub> phase, and the side close to the solder zone is the Cu<sub>6</sub>Sn<sub>5</sub> phase; as the aging time increases, the Cu<sub>5</sub>Zn<sub>8</sub> compound on the solder side grows and is decomposed, and the Cu<sub>3</sub>Sn phase is formed; the nano-Cr particles inhibit the further growth of the IMCs diffusion layer during the aging process; as the content of Cr particles increases, the shear strength and microhardness of the solder joints increase first and then decrease. The shear strength and hardness of the Sn-5Zn-10Bi-10In-0.3Cr/Cu solder joints are the highest; the shear strength is lower than before aging, but the addition of nano-Cr particles keeps the solder joints with good shear strength. After aging, the microhardness of the solder area of the solder joints increases compared with that before aging, but it has always been maintained at below 30HV<sub>0.1</sub>.LIU Guang-zhuYUE DiKANG YuXIE Hong-yuHE Ding-jinJournal of Materials Engineeringarticlelead-free solderwettabilityimcsagingshear strengthMaterials of engineering and construction. Mechanics of materialsTA401-492ZHJournal of Materials Engineering, Vol 49, Iss 11, Pp 163-170 (2021)
institution	DOAJ
collection	DOAJ
language	ZH
topic	lead-free solder wettability imcs aging shear strength Materials of engineering and construction. Mechanics of materials TA401-492
spellingShingle	lead-free solder wettability imcs aging shear strength Materials of engineering and construction. Mechanics of materials TA401-492 LIU Guang-zhu YUE Di KANG Yu XIE Hong-yu HE Ding-jin Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing
description	The new composite solder Sn-5Zn-10Bi-10In-<i>x</i>Cr (<i>x</i>=0%, 0.1%, 0.3%, 0.5%, mass fraction) was made by adding different contents of nano-Cr particles to the Sn-Zn-Bi-In solder. The effect of nano-Cr particles on the microstructure, element distribution, phase composition and mechanical properties of brazing joints before and after aging was studied. The results show that the addition of nano-Cr particles can inhibit the growth of intermetallic compounds (IMCs) in the solder joints. With the increase of the content of nano-Cr particles, the thickness of the IMCs diffusion layer is gradually decreased; the IMCs diffusion layer at the interface near the base material Cu is Cu<sub>5</sub>Zn<sub>8</sub> phase, and the side close to the solder zone is the Cu<sub>6</sub>Sn<sub>5</sub> phase; as the aging time increases, the Cu<sub>5</sub>Zn<sub>8</sub> compound on the solder side grows and is decomposed, and the Cu<sub>3</sub>Sn phase is formed; the nano-Cr particles inhibit the further growth of the IMCs diffusion layer during the aging process; as the content of Cr particles increases, the shear strength and microhardness of the solder joints increase first and then decrease. The shear strength and hardness of the Sn-5Zn-10Bi-10In-0.3Cr/Cu solder joints are the highest; the shear strength is lower than before aging, but the addition of nano-Cr particles keeps the solder joints with good shear strength. After aging, the microhardness of the solder area of the solder joints increases compared with that before aging, but it has always been maintained at below 30HV<sub>0.1</sub>.
format	article
author	LIU Guang-zhu YUE Di KANG Yu XIE Hong-yu HE Ding-jin
author_facet	LIU Guang-zhu YUE Di KANG Yu XIE Hong-yu HE Ding-jin
author_sort	LIU Guang-zhu
title	Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing
title_short	Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing
title_full	Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing
title_fullStr	Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing
title_full_unstemmed	Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing
title_sort	effect of nano-cr particles on solder joint properties of sn-zn-bi-in/cu brazing
publisher	Journal of Materials Engineering
publishDate	2021
url	https://doaj.org/article/60a3c3ffabbd4b80852fabe08c4405fc
work_keys_str_mv	AT liuguangzhu effectofnanocrparticlesonsolderjointpropertiesofsnznbiincubrazing AT yuedi effectofnanocrparticlesonsolderjointpropertiesofsnznbiincubrazing AT kangyu effectofnanocrparticlesonsolderjointpropertiesofsnznbiincubrazing AT xiehongyu effectofnanocrparticlesonsolderjointpropertiesofsnznbiincubrazing AT hedingjin effectofnanocrparticlesonsolderjointpropertiesofsnznbiincubrazing
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Effect of nano-Cr particles on solder joint properties of Sn-Zn-Bi-In/Cu brazing

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