Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection
This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs [B. Grübel et al., in Proceedings 11th SiliconPV C...
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| Autores principales: | , , , , , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
EDP Sciences
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/63194b66057d4c52b7f8283c7557b09e |
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| Sumario: | This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs [B. Grübel et al., in Proceedings 11th SiliconPV Conference, Hamelin, 2021, to be published] due to the substitution of a fully printed silver finger by a stack of a thin nickel seed layer (0.5-1 μm height), highly conductive copper finger (3–10 μm height) and an ultra-thin surface finish by tin (1–3 μm height) or silver (<0.5 μm height). In this study it will be shown that conventional soldering technology can be used to interconnect plated TOPCon solar cells. We manufactured a 60-cell module using industrial processes. The right choice of plating electrolyte allows low stress and ductile metal finger leading to similar reliability in cell breakage experiments compared to state-of-the-art screen-printing metallization. |
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