$Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection$
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Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection

This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs [B. Grübel et al., in Proceedings 11th SiliconPV C...

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Autores principales:	Kluska Sven, Grübel Benjamin, Cimiotti Gisela, Schmiga Christian, Berg Heinrich, Beinert Andreas, Kubitza Irene, Müller Paul, Voss Torsten
Formato:	article
Lenguaje:	EN
Publicado:	EDP Sciences 2021
Materias:	c-si solar cells passivated contact metallization plating Renewable energy sources TJ807-830
Acceso en línea:	https://doaj.org/article/63194b66057d4c52b7f8283c7557b09e
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spelling	oai:doaj.org-article:63194b66057d4c52b7f8283c7557b09e2021-12-02T17:13:19ZPlated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection2105-071610.1051/epjpv/2021010https://doaj.org/article/63194b66057d4c52b7f8283c7557b09e2021-01-01T00:00:00Zhttps://www.epj-pv.org/articles/epjpv/full_html/2021/01/pv210032/pv210032.htmlhttps://doaj.org/toc/2105-0716This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs [B. Grübel et al., in Proceedings 11th SiliconPV Conference, Hamelin, 2021, to be published] due to the substitution of a fully printed silver finger by a stack of a thin nickel seed layer (0.5-1 μm height), highly conductive copper finger (3–10 μm height) and an ultra-thin surface finish by tin (1–3 μm height) or silver (<0.5 μm height). In this study it will be shown that conventional soldering technology can be used to interconnect plated TOPCon solar cells. We manufactured a 60-cell module using industrial processes. The right choice of plating electrolyte allows low stress and ductile metal finger leading to similar reliability in cell breakage experiments compared to state-of-the-art screen-printing metallization.Kluska SvenGrübel BenjaminCimiotti GiselaSchmiga ChristianBerg HeinrichBeinert AndreasKubitza IreneMüller PaulVoss TorstenEDP Sciencesarticlec-si solar cellspassivated contactmetallizationplatingRenewable energy sourcesTJ807-830ENEPJ Photovoltaics, Vol 12, p 10 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	c-si solar cells passivated contact metallization plating Renewable energy sources TJ807-830
spellingShingle	c-si solar cells passivated contact metallization plating Renewable energy sources TJ807-830 Kluska Sven Grübel Benjamin Cimiotti Gisela Schmiga Christian Berg Heinrich Beinert Andreas Kubitza Irene Müller Paul Voss Torsten Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection
description	This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs [B. Grübel et al., in Proceedings 11th SiliconPV Conference, Hamelin, 2021, to be published] due to the substitution of a fully printed silver finger by a stack of a thin nickel seed layer (0.5-1 μm height), highly conductive copper finger (3–10 μm height) and an ultra-thin surface finish by tin (1–3 μm height) or silver (<0.5 μm height). In this study it will be shown that conventional soldering technology can be used to interconnect plated TOPCon solar cells. We manufactured a 60-cell module using industrial processes. The right choice of plating electrolyte allows low stress and ductile metal finger leading to similar reliability in cell breakage experiments compared to state-of-the-art screen-printing metallization.
format	article
author	Kluska Sven Grübel Benjamin Cimiotti Gisela Schmiga Christian Berg Heinrich Beinert Andreas Kubitza Irene Müller Paul Voss Torsten
author_facet	Kluska Sven Grübel Benjamin Cimiotti Gisela Schmiga Christian Berg Heinrich Beinert Andreas Kubitza Irene Müller Paul Voss Torsten
author_sort	Kluska Sven
title	Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection
title_short	Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection
title_full	Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection
title_fullStr	Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection
title_full_unstemmed	Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection
title_sort	plated topcon solar cells & modules with reliable fracture stress and soldered module interconnection
publisher	EDP Sciences
publishDate	2021
url	https://doaj.org/article/63194b66057d4c52b7f8283c7557b09e
work_keys_str_mv	AT kluskasven platedtopconsolarcellsmoduleswithreliablefracturestressandsolderedmoduleinterconnection AT grubelbenjamin platedtopconsolarcellsmoduleswithreliablefracturestressandsolderedmoduleinterconnection AT cimiottigisela platedtopconsolarcellsmoduleswithreliablefracturestressandsolderedmoduleinterconnection AT schmigachristian platedtopconsolarcellsmoduleswithreliablefracturestressandsolderedmoduleinterconnection AT bergheinrich platedtopconsolarcellsmoduleswithreliablefracturestressandsolderedmoduleinterconnection AT beinertandreas platedtopconsolarcellsmoduleswithreliablefracturestressandsolderedmoduleinterconnection AT kubitzairene platedtopconsolarcellsmoduleswithreliablefracturestressandsolderedmoduleinterconnection AT mullerpaul platedtopconsolarcellsmoduleswithreliablefracturestressandsolderedmoduleinterconnection AT vosstorsten platedtopconsolarcellsmoduleswithreliablefracturestressandsolderedmoduleinterconnection
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Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection

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