Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection
This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs [B. Grübel et al., in Proceedings 11th SiliconPV C...
Guardado en:
| Autores principales: | , , , , , , , , |
|---|---|
| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
EDP Sciences
2021
|
| Materias: | |
| Acceso en línea: | https://doaj.org/article/63194b66057d4c52b7f8283c7557b09e |
| Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|