Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection

This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs [B. Grübel et al., in Proceedings 11th SiliconPV C...

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Autores principales: Kluska Sven, Grübel Benjamin, Cimiotti Gisela, Schmiga Christian, Berg Heinrich, Beinert Andreas, Kubitza Irene, Müller Paul, Voss Torsten
Formato: article
Lenguaje:EN
Publicado: EDP Sciences 2021
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Acceso en línea:https://doaj.org/article/63194b66057d4c52b7f8283c7557b09e
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