Plated TOPCon solar cells & modules with reliable fracture stress and soldered module interconnection
This work demonstrates that the application of plated Ni/Cu/Ag contacts for TOPCon solar cells and modules is a reliable alternative to screen-printed metallization. Key advantages of plated metallization is a significant reduction of material costs [B. Grübel et al., in Proceedings 11th SiliconPV C...
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| Autores principales: | , , , , , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
EDP Sciences
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/63194b66057d4c52b7f8283c7557b09e |
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