Effect of mat moisture content and Cu nanoparticles on heat transfer and physical and mechanical properties of poplar particleboard
Effects of mat moisture content (MC) and Cu nanoparticles on heat transfer and physical and mechanical properties of poplar particleboard were investigated. Three levels of mat moisture content (9, 12 and 15%. based on oven dried wood particles) and two levels of Cu nanoparticles (0 and 15% based on...
Guardado en:
| Autores principales: | , |
|---|---|
| Formato: | article |
| Lenguaje: | FA |
| Publicado: |
Regional Information Center for Science and Technology (RICeST)
2012
|
| Materias: | |
| Acceso en línea: | https://doaj.org/article/6404461a4f30483faabcf3f9b874de78 |
| Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
| Sumario: | Effects of mat moisture content (MC) and Cu nanoparticles on heat transfer and physical and mechanical properties of poplar particleboard were investigated. Three levels of mat moisture content (9, 12 and 15%. based on oven dried wood particles) and two levels of Cu nanoparticles (0 and 15% based on oven dried resin) were selected as variable factors. Results indicated that mechanical properties of particleboard improved as MC increases. Cu nanoparticles accelerated the heat transfer from the surface layer to the core layer of the mat and subsequently increased the internal bonding. This positive effect was evident as MC increased. Water absorption and thickness swelling increased as either MC or Cu nanoparticles content was raised. It was observed that the efficiency of Cu nanoparticles on heat transfer was superior at higher MC. Energy Dispersive X-Ray Spectroscopy (EDS) and Scanning Electron Microscopy (SEM) determination revealed that the presence and very well dispersion of Cu nanoparticles in glue line. |
|---|