High-Density Patterned Array Bonding through Void-Free Divinyl Siloxane Bis-Benzocyclobutene Bonding Process
Divinylsiloxane-bis-benzocyclobutene (DVS-BCB) has attracted significant attention as an intermediate bonding material, owing to its excellent properties. However, its applications are limited, due to damage to peripheral devices at high curing temperatures and unoptimized compressive pressure. Ther...
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| Auteurs principaux: | , , , , |
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| Format: | article |
| Langue: | EN |
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MDPI AG
2021
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| Sujets: | |
| Accès en ligne: | https://doaj.org/article/645ed5c9b75240b49110a5a4ee565695 |
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