Effect of PECVD SiNx deposition process parameters on electrical properties of SiNx/AlGaN/GaN structures
The effect of parameters of plasma enhanced chemical vapor deposition (PECVD) processes for SiNx film fabrication on the electrical parameters of dielectric/АlGaN/GaN structures has been studied. The effect of growing film composition, additional heterostructure surface treatment with nitrogen plasm...
Enregistré dans:
Auteurs principaux: | Kira L. Enisherlova, Lev A. Seidman, Ella M. Temper, Yuliy A. Kontsevoy |
---|---|
Format: | article |
Langue: | EN |
Publié: |
Pensoft Publishers
2021
|
Sujets: | |
Accès en ligne: | https://doaj.org/article/69a7427afc664f4f8b01da72c984ae42 |
Tags: |
Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!
|
Documents similaires
-
Impact of process-dependent SiNx passivation on proton-induced degradation in GaN MIS-HEMTs
par: Young Jun Yoon, et autres
Publié: (2021) -
Strain Balanced AlGaN/GaN/AlGaN nanomembrane HEMTs
par: Tzu-Hsuan Chang, et autres
Publié: (2017) -
Graphene/AlGaN/GaN RF Switch
par: Yevhen Yashchyshyn, et autres
Publié: (2021) -
High-resistivity nitrogen-polar GaN for GaN/AlGaN high electron mobility transistors by metalorganic chemical vapor deposition
par: Yang Wang, et autres
Publié: (2021) -
Ultraviolet GaN Light-Emitting Diodes with Porous-AlGaN Reflectors
par: Feng-Hsu Fan, et autres
Publié: (2017)