The Influence of Curing Temperature on Rheological Properties of Epoxy Adhesives
The curing process of three different epoxy adhesives, which are appropriate for bonding wood with metal, was characterized on the basis of their rheology. The rheological measurements were carried out using a TA Instruments ARES G2 stress control rheometer. The infl uence of temperature on the curi...
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University of Zagreb, Faculty of Forestry and Wood Technology
2011
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oai:doaj.org-article:6a34d02da4254bf79758af8cea2f27fa2021-12-02T01:54:39ZThe Influence of Curing Temperature on Rheological Properties of Epoxy Adhesives0012-67721847-1153https://doaj.org/article/6a34d02da4254bf79758af8cea2f27fa2011-03-01T00:00:00Zhttp://hrcak.srce.hr/file/98490https://doaj.org/toc/0012-6772https://doaj.org/toc/1847-1153The curing process of three different epoxy adhesives, which are appropriate for bonding wood with metal, was characterized on the basis of their rheology. The rheological measurements were carried out using a TA Instruments ARES G2 stress control rheometer. The infl uence of temperature on the curing process was examined at fi ve different temperatures: 30, 40, 50, 60 and 80 °C. Curing was monitored by an oscillatory test by using geometry with disposable parallel plates. Gel time and vitrifi cation time were determined. Signifi cant differences in curing behaviour were observed among the studied adhesives. The results showed that increasing the curing temperature signifi cantly accelerated the curing process of the epoxy adhesives. It was also observed that the storage modulus G’ and the loss modulus G” decreased with an increasing temperature of curing.Maksimiljan MravljakMilan ŠernekUniversity of Zagreb, Faculty of Forestry and Wood Technologyarticleepoxy adhesivesgel pointloss modulusrheologystorage modulusForestrySD1-669.5ENDrvna Industrija, Vol 62, Iss 1, Pp 19-25 (2011) |
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epoxy adhesives gel point loss modulus rheology storage modulus Forestry SD1-669.5 |
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epoxy adhesives gel point loss modulus rheology storage modulus Forestry SD1-669.5 Maksimiljan Mravljak Milan Šernek The Influence of Curing Temperature on Rheological Properties of Epoxy Adhesives |
description |
The curing process of three different epoxy adhesives, which are appropriate for bonding wood with metal, was characterized on the basis of their rheology. The rheological measurements were carried out using a TA Instruments ARES G2 stress control rheometer. The infl uence of temperature on the curing process was examined at fi ve different temperatures: 30, 40, 50, 60 and 80 °C. Curing was monitored by an oscillatory test by using geometry with disposable parallel plates. Gel time and vitrifi cation time were determined. Signifi cant differences in curing behaviour were observed among the studied adhesives. The results showed that increasing the curing temperature signifi cantly accelerated the curing process of the epoxy adhesives. It was also observed that the storage modulus G’ and the loss modulus G” decreased with an increasing temperature of curing. |
format |
article |
author |
Maksimiljan Mravljak Milan Šernek |
author_facet |
Maksimiljan Mravljak Milan Šernek |
author_sort |
Maksimiljan Mravljak |
title |
The Influence of Curing Temperature on Rheological Properties of Epoxy Adhesives |
title_short |
The Influence of Curing Temperature on Rheological Properties of Epoxy Adhesives |
title_full |
The Influence of Curing Temperature on Rheological Properties of Epoxy Adhesives |
title_fullStr |
The Influence of Curing Temperature on Rheological Properties of Epoxy Adhesives |
title_full_unstemmed |
The Influence of Curing Temperature on Rheological Properties of Epoxy Adhesives |
title_sort |
influence of curing temperature on rheological properties of epoxy adhesives |
publisher |
University of Zagreb, Faculty of Forestry and Wood Technology |
publishDate |
2011 |
url |
https://doaj.org/article/6a34d02da4254bf79758af8cea2f27fa |
work_keys_str_mv |
AT maksimiljanmravljak theinfluenceofcuringtemperatureonrheologicalpropertiesofepoxyadhesives AT milansernek theinfluenceofcuringtemperatureonrheologicalpropertiesofepoxyadhesives AT maksimiljanmravljak influenceofcuringtemperatureonrheologicalpropertiesofepoxyadhesives AT milansernek influenceofcuringtemperatureonrheologicalpropertiesofepoxyadhesives |
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1718402843483832320 |