Joining Ti6Al4V to Alumina by Diffusion Bonding Using Titanium Interlayers

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Joining Ti6Al4V to Alumina by Diffusion Bonding Using Titanium Interlayers

This work aims to investigate the joining of Ti6Al4V alloy to alumina by diffusion bonding using titanium interlayers: thin films (1 µm) and commercial titanium foils (5 µm). The Ti thin films were deposited by magnetron sputtering onto alumina. The joints were processed at 900, 950, and 1000 °C, dw...

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Detalles Bibliográficos
Autores principales:	Marcionilo Silva, Ana S. Ramos, Sónia Simões
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	diffusion bonding thin film titanium Al<sub>2</sub>O<sub>3</sub> sputtering Mining engineering. Metallurgy TN1-997
Acceso en línea:	https://doaj.org/article/6ba8af817c5e452eb6a54e258e0979c5
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

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