In-situ study of electrochemical migration of tin in the presence of bromide ion

Abstract The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically invest...

Descripción completa

Guardado en:

Detalles Bibliográficos
Autores principales:	Ee Lynn Lee, A. S. M. A. Haseeb, Wan Jeffrey Basirun, Yew Hoong Wong, Mohd Faizul Mohd Sabri, Boon Yew Low
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2021
Materias:	Medicine R Science Q
Acceso en línea:	https://doaj.org/article/6c4c90f2cbd74ae7b06b7987d201c52f
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

id	oai:doaj.org-article:6c4c90f2cbd74ae7b06b7987d201c52f
record_format	dspace
spelling	oai:doaj.org-article:6c4c90f2cbd74ae7b06b7987d201c52f2021-12-02T17:06:31ZIn-situ study of electrochemical migration of tin in the presence of bromide ion10.1038/s41598-021-95276-02045-2322https://doaj.org/article/6c4c90f2cbd74ae7b06b7987d201c52f2021-08-01T00:00:00Zhttps://doi.org/10.1038/s41598-021-95276-0https://doaj.org/toc/2045-2322Abstract The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically investigates the ECM of tin (Sn) in the presence of bromide ions (Br−) in the range of 10−6 M to 1.0 M. Water drop test (WDT) was conducted in the two-probe semiconductor characterization system under an optical microscope as an in-situ observation. Polarization test was carried out to study the correlation between the corrosion properties of Sn and its ECM behaviour. The products of ECM were characterized by scanning electron microscope coupled with an energy dispersive X-rays spectrometer (SEM/EDX) and X-ray photoelectron spectrometer (XPS). The results confirm that the rate of anodic dissolution of Sn monotonously increases with the Br− concentration. However, the probability of ECM failure follows a normal distribution initially, but later increases with the Br− concentration. The main products of the ECM reactions are identified as Sn dendrites and tin hydroxide precipitates. The mechanisms of the ECM process of Sn in the presence of Br− are also suggested.Ee Lynn LeeA. S. M. A. HaseebWan Jeffrey BasirunYew Hoong WongMohd Faizul Mohd SabriBoon Yew LowNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 11, Iss 1, Pp 1-15 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	Medicine R Science Q
spellingShingle	Medicine R Science Q Ee Lynn Lee A. S. M. A. Haseeb Wan Jeffrey Basirun Yew Hoong Wong Mohd Faizul Mohd Sabri Boon Yew Low In-situ study of electrochemical migration of tin in the presence of bromide ion
description	Abstract The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically investigates the ECM of tin (Sn) in the presence of bromide ions (Br−) in the range of 10−6 M to 1.0 M. Water drop test (WDT) was conducted in the two-probe semiconductor characterization system under an optical microscope as an in-situ observation. Polarization test was carried out to study the correlation between the corrosion properties of Sn and its ECM behaviour. The products of ECM were characterized by scanning electron microscope coupled with an energy dispersive X-rays spectrometer (SEM/EDX) and X-ray photoelectron spectrometer (XPS). The results confirm that the rate of anodic dissolution of Sn monotonously increases with the Br− concentration. However, the probability of ECM failure follows a normal distribution initially, but later increases with the Br− concentration. The main products of the ECM reactions are identified as Sn dendrites and tin hydroxide precipitates. The mechanisms of the ECM process of Sn in the presence of Br− are also suggested.
format	article
author	Ee Lynn Lee A. S. M. A. Haseeb Wan Jeffrey Basirun Yew Hoong Wong Mohd Faizul Mohd Sabri Boon Yew Low
author_facet	Ee Lynn Lee A. S. M. A. Haseeb Wan Jeffrey Basirun Yew Hoong Wong Mohd Faizul Mohd Sabri Boon Yew Low
author_sort	Ee Lynn Lee
title	In-situ study of electrochemical migration of tin in the presence of bromide ion
title_short	In-situ study of electrochemical migration of tin in the presence of bromide ion
title_full	In-situ study of electrochemical migration of tin in the presence of bromide ion
title_fullStr	In-situ study of electrochemical migration of tin in the presence of bromide ion
title_full_unstemmed	In-situ study of electrochemical migration of tin in the presence of bromide ion
title_sort	in-situ study of electrochemical migration of tin in the presence of bromide ion
publisher	Nature Portfolio
publishDate	2021
url	https://doaj.org/article/6c4c90f2cbd74ae7b06b7987d201c52f
work_keys_str_mv	AT eelynnlee insitustudyofelectrochemicalmigrationoftininthepresenceofbromideion AT asmahaseeb insitustudyofelectrochemicalmigrationoftininthepresenceofbromideion AT wanjeffreybasirun insitustudyofelectrochemicalmigrationoftininthepresenceofbromideion AT yewhoongwong insitustudyofelectrochemicalmigrationoftininthepresenceofbromideion AT mohdfaizulmohdsabri insitustudyofelectrochemicalmigrationoftininthepresenceofbromideion AT boonyewlow insitustudyofelectrochemicalmigrationoftininthepresenceofbromideion
_version_	1718381558234087424

In-situ study of electrochemical migration of tin in the presence of bromide ion

Ejemplares similares