In-situ study of electrochemical migration of tin in the presence of bromide ion

In-situ study of electrochemical migration of tin in the presence of bromide ion

Abstract The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically invest...

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Autores principales: Ee Lynn Lee, A. S. M. A. Haseeb, Wan Jeffrey Basirun, Yew Hoong Wong, Mohd Faizul Mohd Sabri, Boon Yew Low
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2021
Materias:
Medicine
R
Science
Q
Acceso en línea:https://doaj.org/article/6c4c90f2cbd74ae7b06b7987d201c52f
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