3D printing path planning algorithm for thin walled and complex devices

With the popularity of stereo printing technology, 3D printers are widely used in industry, manufacturing, medicine, and other industries to quickly manufacture small devices. Before 3D printing, it is necessary to plan the printing path. Unreasonable printing path will not only increase the time co...

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Autores principales: Yang Min, Lai Menggang, Liu Shengjun
Formato: article
Lenguaje:EN
Publicado: De Gruyter 2021
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Acceso en línea:https://doaj.org/article/6d863554a229465499f6487bcb69f1cd
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spelling oai:doaj.org-article:6d863554a229465499f6487bcb69f1cd2021-12-05T14:11:03Z3D printing path planning algorithm for thin walled and complex devices2191-035910.1515/secm-2021-0032https://doaj.org/article/6d863554a229465499f6487bcb69f1cd2021-07-01T00:00:00Zhttps://doi.org/10.1515/secm-2021-0032https://doaj.org/toc/2191-0359With the popularity of stereo printing technology, 3D printers are widely used in industry, manufacturing, medicine, and other industries to quickly manufacture small devices. Before 3D printing, it is necessary to plan the printing path. Unreasonable printing path will not only increase the time consumption of printing products, but also cause printing failure due to the accumulation of stress and deformation in the printing process. In order to overcome the superimposed stress and deformation in the process of printing thin-walled complex devices, this article introduces the idea of balanced stress based on the basic damage of the path planning based on the potential field method. In the printing process, the ring path, island path and cross path are added to overcome the stress deformation phenomenon and improve the printing quality. Finally, the 3D printer is used to manufacture thin-walled complex devices, and the feasibility of the balanced potential field method is verified by physical comparison.Yang MinLai MenggangLiu ShengjunDe Gruyterarticle3d printingpath planningpotential field methodbalanced stressMaterials of engineering and construction. Mechanics of materialsTA401-492ENScience and Engineering of Composite Materials, Vol 28, Iss 1, Pp 327-334 (2021)
institution DOAJ
collection DOAJ
language EN
topic 3d printing
path planning
potential field method
balanced stress
Materials of engineering and construction. Mechanics of materials
TA401-492
spellingShingle 3d printing
path planning
potential field method
balanced stress
Materials of engineering and construction. Mechanics of materials
TA401-492
Yang Min
Lai Menggang
Liu Shengjun
3D printing path planning algorithm for thin walled and complex devices
description With the popularity of stereo printing technology, 3D printers are widely used in industry, manufacturing, medicine, and other industries to quickly manufacture small devices. Before 3D printing, it is necessary to plan the printing path. Unreasonable printing path will not only increase the time consumption of printing products, but also cause printing failure due to the accumulation of stress and deformation in the printing process. In order to overcome the superimposed stress and deformation in the process of printing thin-walled complex devices, this article introduces the idea of balanced stress based on the basic damage of the path planning based on the potential field method. In the printing process, the ring path, island path and cross path are added to overcome the stress deformation phenomenon and improve the printing quality. Finally, the 3D printer is used to manufacture thin-walled complex devices, and the feasibility of the balanced potential field method is verified by physical comparison.
format article
author Yang Min
Lai Menggang
Liu Shengjun
author_facet Yang Min
Lai Menggang
Liu Shengjun
author_sort Yang Min
title 3D printing path planning algorithm for thin walled and complex devices
title_short 3D printing path planning algorithm for thin walled and complex devices
title_full 3D printing path planning algorithm for thin walled and complex devices
title_fullStr 3D printing path planning algorithm for thin walled and complex devices
title_full_unstemmed 3D printing path planning algorithm for thin walled and complex devices
title_sort 3d printing path planning algorithm for thin walled and complex devices
publisher De Gruyter
publishDate 2021
url https://doaj.org/article/6d863554a229465499f6487bcb69f1cd
work_keys_str_mv AT yangmin 3dprintingpathplanningalgorithmforthinwalledandcomplexdevices
AT laimenggang 3dprintingpathplanningalgorithmforthinwalledandcomplexdevices
AT liushengjun 3dprintingpathplanningalgorithmforthinwalledandcomplexdevices
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