Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing

In recent years, with the rapid development of the flexible electronics industry, there is an urgent need for a large-area, multilayer, and high-production integrated manufacturing technology for scalable and flexible electronic products. To solve this technical demand, researchers have proposed and...

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Autores principales:	Li Zhang, Chong Zhang, Zheng Tan, Jingrong Tang, Chi Yao, Bo Hao
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	flexible electronics microtransfer printing mechanical model PDMS seal SMP seal ink Mechanical engineering and machinery TJ1-1570
Acceso en línea:	https://doaj.org/article/733446a40511485fa75971e4df227f8e
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id	oai:doaj.org-article:733446a40511485fa75971e4df227f8e
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spelling	oai:doaj.org-article:733446a40511485fa75971e4df227f8e2021-11-25T18:23:23ZResearch Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing10.3390/mi121113582072-666Xhttps://doaj.org/article/733446a40511485fa75971e4df227f8e2021-11-01T00:00:00Zhttps://www.mdpi.com/2072-666X/12/11/1358https://doaj.org/toc/2072-666XIn recent years, with the rapid development of the flexible electronics industry, there is an urgent need for a large-area, multilayer, and high-production integrated manufacturing technology for scalable and flexible electronic products. To solve this technical demand, researchers have proposed and developed microtransfer printing technology, which picks up and prints inks in various material forms from the donor substrate to the target substrate, successfully realizing the integrated manufacturing of flexible electronic products. This review retrospects the representative research progress of microtransfer printing technology for the production of flexible electronic products and emphasizes the summary of seal materials, the basic principles of various transfer technology and fracture mechanics models, and the influence of different factors on the transfer effect. In the end, the unique functions, technical features, and related printing examples of each technology are concluded and compared, and the prospects of further research work on microtransfer printing technology is finally presented.Li ZhangChong ZhangZheng TanJingrong TangChi YaoBo HaoMDPI AGarticleflexible electronicsmicrotransfer printingmechanical modelPDMS sealSMP sealinkMechanical engineering and machineryTJ1-1570ENMicromachines, Vol 12, Iss 1358, p 1358 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	flexible electronics microtransfer printing mechanical model PDMS seal SMP seal ink Mechanical engineering and machinery TJ1-1570
spellingShingle	flexible electronics microtransfer printing mechanical model PDMS seal SMP seal ink Mechanical engineering and machinery TJ1-1570 Li Zhang Chong Zhang Zheng Tan Jingrong Tang Chi Yao Bo Hao Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing
description	In recent years, with the rapid development of the flexible electronics industry, there is an urgent need for a large-area, multilayer, and high-production integrated manufacturing technology for scalable and flexible electronic products. To solve this technical demand, researchers have proposed and developed microtransfer printing technology, which picks up and prints inks in various material forms from the donor substrate to the target substrate, successfully realizing the integrated manufacturing of flexible electronic products. This review retrospects the representative research progress of microtransfer printing technology for the production of flexible electronic products and emphasizes the summary of seal materials, the basic principles of various transfer technology and fracture mechanics models, and the influence of different factors on the transfer effect. In the end, the unique functions, technical features, and related printing examples of each technology are concluded and compared, and the prospects of further research work on microtransfer printing technology is finally presented.
format	article
author	Li Zhang Chong Zhang Zheng Tan Jingrong Tang Chi Yao Bo Hao
author_facet	Li Zhang Chong Zhang Zheng Tan Jingrong Tang Chi Yao Bo Hao
author_sort	Li Zhang
title	Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing
title_short	Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing
title_full	Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing
title_fullStr	Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing
title_full_unstemmed	Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing
title_sort	research progress of microtransfer printing technology for flexible electronic integrated manufacturing
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/733446a40511485fa75971e4df227f8e
work_keys_str_mv	AT lizhang researchprogressofmicrotransferprintingtechnologyforflexibleelectronicintegratedmanufacturing AT chongzhang researchprogressofmicrotransferprintingtechnologyforflexibleelectronicintegratedmanufacturing AT zhengtan researchprogressofmicrotransferprintingtechnologyforflexibleelectronicintegratedmanufacturing AT jingrongtang researchprogressofmicrotransferprintingtechnologyforflexibleelectronicintegratedmanufacturing AT chiyao researchprogressofmicrotransferprintingtechnologyforflexibleelectronicintegratedmanufacturing AT bohao researchprogressofmicrotransferprintingtechnologyforflexibleelectronicintegratedmanufacturing
_version_	1718411265710227456

Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing

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