Curvy surface conformal ultra-thin transfer printed Si optoelectronic penetrating microprobe arrays

Soft circuits: silicon microprobe array made penetrating Silicon microprobe vertial array has now been made ultra-thin, flexible and suitable for soft tissue integration. A team led by Cunjiang Yu from University of Houston, USA designs an ultra-thin and flexible 3D penetrating microprobe array that...

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Autores principales:	Kyoseung Sim, Zhoulyu Rao, Yanbin Li, Dong Yang, Cunjiang Yu
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2018
Materias:	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492
Acceso en línea:	https://doaj.org/article/75fe944c829c420294c6240c43e63572
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spelling	oai:doaj.org-article:75fe944c829c420294c6240c43e635722021-12-02T18:17:29ZCurvy surface conformal ultra-thin transfer printed Si optoelectronic penetrating microprobe arrays10.1038/s41528-017-0015-82397-4621https://doaj.org/article/75fe944c829c420294c6240c43e635722018-01-01T00:00:00Zhttps://doi.org/10.1038/s41528-017-0015-8https://doaj.org/toc/2397-4621Soft circuits: silicon microprobe array made penetrating Silicon microprobe vertial array has now been made ultra-thin, flexible and suitable for soft tissue integration. A team led by Cunjiang Yu from University of Houston, USA designs an ultra-thin and flexible 3D penetrating microprobe array that is compatible with soft electronics and tissue interfacing and mapping. The microprobe array is fabricated via transfer printing of ultra-thin silicon circuits onto an ultra-thin polyimide support, followed by iron layer deposition, magnetic actuation and epoxy solidification to make and fix the perpendicular and penetrating probes. This work tackles the problems of the mechanical and geometric mismatch between the soft surfaces and relatively rigid electronic circuits with conventional semiconductor fabrication technologies. It will bring immediate interest in developing multi-functioning and bio-integrated applications.Kyoseung SimZhoulyu RaoYanbin LiDong YangCunjiang YuNature PortfolioarticleElectronicsTK7800-8360Materials of engineering and construction. Mechanics of materialsTA401-492ENnpj Flexible Electronics, Vol 2, Iss 1, Pp 1-6 (2018)
institution	DOAJ
collection	DOAJ
language	EN
topic	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492
spellingShingle	Electronics TK7800-8360 Materials of engineering and construction. Mechanics of materials TA401-492 Kyoseung Sim Zhoulyu Rao Yanbin Li Dong Yang Cunjiang Yu Curvy surface conformal ultra-thin transfer printed Si optoelectronic penetrating microprobe arrays
description	Soft circuits: silicon microprobe array made penetrating Silicon microprobe vertial array has now been made ultra-thin, flexible and suitable for soft tissue integration. A team led by Cunjiang Yu from University of Houston, USA designs an ultra-thin and flexible 3D penetrating microprobe array that is compatible with soft electronics and tissue interfacing and mapping. The microprobe array is fabricated via transfer printing of ultra-thin silicon circuits onto an ultra-thin polyimide support, followed by iron layer deposition, magnetic actuation and epoxy solidification to make and fix the perpendicular and penetrating probes. This work tackles the problems of the mechanical and geometric mismatch between the soft surfaces and relatively rigid electronic circuits with conventional semiconductor fabrication technologies. It will bring immediate interest in developing multi-functioning and bio-integrated applications.
format	article
author	Kyoseung Sim Zhoulyu Rao Yanbin Li Dong Yang Cunjiang Yu
author_facet	Kyoseung Sim Zhoulyu Rao Yanbin Li Dong Yang Cunjiang Yu
author_sort	Kyoseung Sim
title	Curvy surface conformal ultra-thin transfer printed Si optoelectronic penetrating microprobe arrays
title_short	Curvy surface conformal ultra-thin transfer printed Si optoelectronic penetrating microprobe arrays
title_full	Curvy surface conformal ultra-thin transfer printed Si optoelectronic penetrating microprobe arrays
title_fullStr	Curvy surface conformal ultra-thin transfer printed Si optoelectronic penetrating microprobe arrays
title_full_unstemmed	Curvy surface conformal ultra-thin transfer printed Si optoelectronic penetrating microprobe arrays
title_sort	curvy surface conformal ultra-thin transfer printed si optoelectronic penetrating microprobe arrays
publisher	Nature Portfolio
publishDate	2018
url	https://doaj.org/article/75fe944c829c420294c6240c43e63572
work_keys_str_mv	AT kyoseungsim curvysurfaceconformalultrathintransferprintedsioptoelectronicpenetratingmicroprobearrays AT zhoulyurao curvysurfaceconformalultrathintransferprintedsioptoelectronicpenetratingmicroprobearrays AT yanbinli curvysurfaceconformalultrathintransferprintedsioptoelectronicpenetratingmicroprobearrays AT dongyang curvysurfaceconformalultrathintransferprintedsioptoelectronicpenetratingmicroprobearrays AT cunjiangyu curvysurfaceconformalultrathintransferprintedsioptoelectronicpenetratingmicroprobearrays
_version_	1718378283179966464

Curvy surface conformal ultra-thin transfer printed Si optoelectronic penetrating microprobe arrays

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