Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure
As the miniaturization of electronic appliances and microprocessors progresses, low-permittivity interlayer materials are becoming increasingly important for their suppression of electronic crosstalk, signal propagation delay and loss, and so forth. Herein, a kind of copolyimide (CPI) film with a “f...
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MDPI AG
2021
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oai:doaj.org-article:7a9fed6021e04076a863e31a010e3d342021-11-11T17:50:59ZLow—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure10.3390/ma142162661996-1944https://doaj.org/article/7a9fed6021e04076a863e31a010e3d342021-10-01T00:00:00Zhttps://www.mdpi.com/1996-1944/14/21/6266https://doaj.org/toc/1996-1944As the miniaturization of electronic appliances and microprocessors progresses, low-permittivity interlayer materials are becoming increasingly important for their suppression of electronic crosstalk, signal propagation delay and loss, and so forth. Herein, a kind of copolyimide (CPI) film with a “fluorene” rigid conjugated structure was prepared successfully. By introducing 9,9-Bis(3-fluoro-4-aminophenyl) fluorene as the rigid conjugated structure monomer, a series of CPI films with different molecular weights were fabricated by in situ polymerization, which not only achieved the reduction of permittivity but also maintained excellent thermodynamic stability. Moreover, the hydrophobicity of the CPI film was also improved with the increasing conjugated structure fraction. The lowest permittivity reached 2.53 at 10<sup>6</sup> Hz, while the thermal decomposition temperature (<i>T</i><sub>d5%</sub>) was up to 530 °C, and the tensile strength was ≥ 96 MPa. Thus, the CPI films are potential dielectric materials for microelectronic and insulation applications.Xiaodi DongMingsheng ZhengBaoquan WanXuejie LiuHaiping XuJunwei ZhaMDPI AGarticlecopolyimidelow permittivitythermal stabilityconjugated structureTechnologyTElectrical engineering. Electronics. Nuclear engineeringTK1-9971Engineering (General). Civil engineering (General)TA1-2040MicroscopyQH201-278.5Descriptive and experimental mechanicsQC120-168.85ENMaterials, Vol 14, Iss 6266, p 6266 (2021) |
| institution |
DOAJ |
| collection |
DOAJ |
| language |
EN |
| topic |
copolyimide low permittivity thermal stability conjugated structure Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85 |
| spellingShingle |
copolyimide low permittivity thermal stability conjugated structure Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85 Xiaodi Dong Mingsheng Zheng Baoquan Wan Xuejie Liu Haiping Xu Junwei Zha Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure |
| description |
As the miniaturization of electronic appliances and microprocessors progresses, low-permittivity interlayer materials are becoming increasingly important for their suppression of electronic crosstalk, signal propagation delay and loss, and so forth. Herein, a kind of copolyimide (CPI) film with a “fluorene” rigid conjugated structure was prepared successfully. By introducing 9,9-Bis(3-fluoro-4-aminophenyl) fluorene as the rigid conjugated structure monomer, a series of CPI films with different molecular weights were fabricated by in situ polymerization, which not only achieved the reduction of permittivity but also maintained excellent thermodynamic stability. Moreover, the hydrophobicity of the CPI film was also improved with the increasing conjugated structure fraction. The lowest permittivity reached 2.53 at 10<sup>6</sup> Hz, while the thermal decomposition temperature (<i>T</i><sub>d5%</sub>) was up to 530 °C, and the tensile strength was ≥ 96 MPa. Thus, the CPI films are potential dielectric materials for microelectronic and insulation applications. |
| format |
article |
| author |
Xiaodi Dong Mingsheng Zheng Baoquan Wan Xuejie Liu Haiping Xu Junwei Zha |
| author_facet |
Xiaodi Dong Mingsheng Zheng Baoquan Wan Xuejie Liu Haiping Xu Junwei Zha |
| author_sort |
Xiaodi Dong |
| title |
Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure |
| title_short |
Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure |
| title_full |
Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure |
| title_fullStr |
Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure |
| title_full_unstemmed |
Low—Permittivity Copolymerized Polyimides with Fluorene Rigid Conjugated Structure |
| title_sort |
low—permittivity copolymerized polyimides with fluorene rigid conjugated structure |
| publisher |
MDPI AG |
| publishDate |
2021 |
| url |
https://doaj.org/article/7a9fed6021e04076a863e31a010e3d34 |
| work_keys_str_mv |
AT xiaodidong lowpermittivitycopolymerizedpolyimideswithfluorenerigidconjugatedstructure AT mingshengzheng lowpermittivitycopolymerizedpolyimideswithfluorenerigidconjugatedstructure AT baoquanwan lowpermittivitycopolymerizedpolyimideswithfluorenerigidconjugatedstructure AT xuejieliu lowpermittivitycopolymerizedpolyimideswithfluorenerigidconjugatedstructure AT haipingxu lowpermittivitycopolymerizedpolyimideswithfluorenerigidconjugatedstructure AT junweizha lowpermittivitycopolymerizedpolyimideswithfluorenerigidconjugatedstructure |
| _version_ |
1718432009028632576 |