Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites

Benzocyclobutene-modified silsesquioxane (BCB-POSS) and divinyl tetramethyl disiloxane-bisbenzocyclobutene (DVS-BCB) prepolymer were introduced into the containing benzocyclobutene (BCB) unit matrix resin P(4-MB-co-1-MP) polymerized from 1-methyl-1-(4-benzocyclobutenyl) silacyclobutane (4-MSCBBCB) a...

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Autores principales:	Xian Li, Nan Zhong, Huan Hu, Yufan Zhang, Yawen Huang, Xu Ye, Junxiao Yang
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	benzocyclobutene resin BCB-POSS DVS-BCB composites dielectric properties heat resistance Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85
Acceso en línea:	https://doaj.org/article/7af7888e93b7421b9a90b1084ab05be0
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spelling	oai:doaj.org-article:7af7888e93b7421b9a90b1084ab05be02021-11-11T18:06:30ZPreparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites10.3390/ma142165481996-1944https://doaj.org/article/7af7888e93b7421b9a90b1084ab05be02021-11-01T00:00:00Zhttps://www.mdpi.com/1996-1944/14/21/6548https://doaj.org/toc/1996-1944Benzocyclobutene-modified silsesquioxane (BCB-POSS) and divinyl tetramethyl disiloxane-bisbenzocyclobutene (DVS-BCB) prepolymer were introduced into the containing benzocyclobutene (BCB) unit matrix resin P(4-MB-co-1-MP) polymerized from 1-methyl-1-(4-benzocyclobutenyl) silacyclobutane (4-MSCBBCB) and 1-methyl-1-phenylsilacyclobutane (1-MPSCB), respectively. The low dielectric constant (low-<i>k</i>) siloxane/carbosilane hybrid benzocyclobutene resin composites, P(4-MB-co-1-MP)/BCB-POSS and P(4-MB-co-1-MP)/DVS-BCB, were prepared. The curing processes of the composites were assessed via Fourier-transform infrared spectroscopy (FTIR) and differential scanning calorimetry (DSC). The effects on dielectric properties and heat resistance of those composites with different proportion of BCB-POSS and DVS-BCB were investigated using an impedance analyzer and thermogravimetric analyzer (TGA), respectively. The thermal curing of composites could be carried out by ring-opening polymerization (ROP) of the BCB four-member rings of BCB-POSS or DVS-BCB and those of P(4-MB-co-1-MP). With increasing the proportion of BCB-POSS to 30%, the 5% weight loss temperature (<i>T</i><sub>5%</sub>) of P(4-MB-co-1-MP)/BCB-POSS composites was raised visibly, whereas the dielectric constant (<i>k</i>) was decreased owing to the introduction of nanopores into POSS. For P(4-MB-co-1-MP)/DVS-BCB composites, the <i>T</i><sub>5%</sub> and <i>k</i> were slightly raised with increasing the proportion of DVS-BCB. The above results indicated that the BCB-POSS showed advantages over conventional fillers to simultaneously improve thermostability and decrease <i>k</i>.Xian LiNan ZhongHuan HuYufan ZhangYawen HuangXu YeJunxiao YangMDPI AGarticlebenzocyclobutene resinBCB-POSSDVS-BCBcompositesdielectric propertiesheat resistanceTechnologyTElectrical engineering. Electronics. Nuclear engineeringTK1-9971Engineering (General). Civil engineering (General)TA1-2040MicroscopyQH201-278.5Descriptive and experimental mechanicsQC120-168.85ENMaterials, Vol 14, Iss 6548, p 6548 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	benzocyclobutene resin BCB-POSS DVS-BCB composites dielectric properties heat resistance Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85
spellingShingle	benzocyclobutene resin BCB-POSS DVS-BCB composites dielectric properties heat resistance Technology T Electrical engineering. Electronics. Nuclear engineering TK1-9971 Engineering (General). Civil engineering (General) TA1-2040 Microscopy QH201-278.5 Descriptive and experimental mechanics QC120-168.85 Xian Li Nan Zhong Huan Hu Yufan Zhang Yawen Huang Xu Ye Junxiao Yang Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites
description	Benzocyclobutene-modified silsesquioxane (BCB-POSS) and divinyl tetramethyl disiloxane-bisbenzocyclobutene (DVS-BCB) prepolymer were introduced into the containing benzocyclobutene (BCB) unit matrix resin P(4-MB-co-1-MP) polymerized from 1-methyl-1-(4-benzocyclobutenyl) silacyclobutane (4-MSCBBCB) and 1-methyl-1-phenylsilacyclobutane (1-MPSCB), respectively. The low dielectric constant (low-<i>k</i>) siloxane/carbosilane hybrid benzocyclobutene resin composites, P(4-MB-co-1-MP)/BCB-POSS and P(4-MB-co-1-MP)/DVS-BCB, were prepared. The curing processes of the composites were assessed via Fourier-transform infrared spectroscopy (FTIR) and differential scanning calorimetry (DSC). The effects on dielectric properties and heat resistance of those composites with different proportion of BCB-POSS and DVS-BCB were investigated using an impedance analyzer and thermogravimetric analyzer (TGA), respectively. The thermal curing of composites could be carried out by ring-opening polymerization (ROP) of the BCB four-member rings of BCB-POSS or DVS-BCB and those of P(4-MB-co-1-MP). With increasing the proportion of BCB-POSS to 30%, the 5% weight loss temperature (<i>T</i><sub>5%</sub>) of P(4-MB-co-1-MP)/BCB-POSS composites was raised visibly, whereas the dielectric constant (<i>k</i>) was decreased owing to the introduction of nanopores into POSS. For P(4-MB-co-1-MP)/DVS-BCB composites, the <i>T</i><sub>5%</sub> and <i>k</i> were slightly raised with increasing the proportion of DVS-BCB. The above results indicated that the BCB-POSS showed advantages over conventional fillers to simultaneously improve thermostability and decrease <i>k</i>.
format	article
author	Xian Li Nan Zhong Huan Hu Yufan Zhang Yawen Huang Xu Ye Junxiao Yang
author_facet	Xian Li Nan Zhong Huan Hu Yufan Zhang Yawen Huang Xu Ye Junxiao Yang
author_sort	Xian Li
title	Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites
title_short	Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites
title_full	Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites
title_fullStr	Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites
title_full_unstemmed	Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites
title_sort	preparation and properties of low dielectric constant siloxane/carbosilane hybrid benzocyclobutene resin composites
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/7af7888e93b7421b9a90b1084ab05be0
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Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites

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