Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites

Preparation and Properties of Low Dielectric Constant Siloxane/Carbosilane Hybrid Benzocyclobutene Resin Composites

Benzocyclobutene-modified silsesquioxane (BCB-POSS) and divinyl tetramethyl disiloxane-bisbenzocyclobutene (DVS-BCB) prepolymer were introduced into the containing benzocyclobutene (BCB) unit matrix resin P(4-MB-co-1-MP) polymerized from 1-methyl-1-(4-benzocyclobutenyl) silacyclobutane (4-MSCBBCB) a...

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Enregistré dans:
Détails bibliographiques
Auteurs principaux: Xian Li, Nan Zhong, Huan Hu, Yufan Zhang, Yawen Huang, Xu Ye, Junxiao Yang
Format: article
Langue:EN
Publié: MDPI AG 2021
Sujets:
benzocyclobutene resin
BCB-POSS
DVS-BCB
composites
dielectric properties
heat resistance
Technology
T
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
Engineering (General). Civil engineering (General)
TA1-2040
Microscopy
QH201-278.5
Descriptive and experimental mechanics
QC120-168.85
Accès en ligne:https://doaj.org/article/7af7888e93b7421b9a90b1084ab05be0
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Internet

https://doaj.org/article/7af7888e93b7421b9a90b1084ab05be0

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