Characterization of 3D Printed Yttria-Stabilized Zirconia Parts for Use in Prostheses

The main aim of the present paper is to study and analyze surface roughness, shrinkage, porosity, and mechanical strength of dense yttria-stabilized zirconia (YSZ) samples obtained by means of the extrusion printing technique. In the experiments, both print speed and layer height were varied, accord...

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Autores principales: Irene Buj-Corral, Daniel Vidal, Aitor Tejo-Otero, José Antonio Padilla, Elena Xuriguera, Felip Fenollosa-Artés
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
Materias:
Sa
Acceso en línea:https://doaj.org/article/7b9b4a8d7fec49a6a75969e6847bdaaf
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Sumario:The main aim of the present paper is to study and analyze surface roughness, shrinkage, porosity, and mechanical strength of dense yttria-stabilized zirconia (YSZ) samples obtained by means of the extrusion printing technique. In the experiments, both print speed and layer height were varied, according to a 2<sup>2</sup> factorial design. Cuboid samples were defined, and three replicates were obtained for each experiment. After sintering, the shrinkage percentage was calculated in width and in height. Areal surface roughness, S<sub>a</sub>, was measured on the lateral walls of the cuboids, and total porosity was determined by means of weight measurement. The compressive strength of the samples was determined. The lowest S<sub>a</sub> value of 9.4 μm was obtained with low layer height and high print speed. Shrinkage percentage values ranged between 19% and 28%, and porosity values between 12% and 24%, depending on the printing conditions. Lowest porosity values correspond to low layer height and low print speed. The same conditions allow obtaining the highest average compressive strength value of 176 MPa, although high variability was observed. For this reason, further research will be carried out about mechanical strength of ceramic 3D printed samples. The results of this work will help choose appropriate printing conditions extrusion processes for ceramics.