Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L

This work deals with determination of optimum conditions of direct diffusion bonding welding of austenitic stainlesssteel type AISI 304L with Oxygen Free High Conductivity (OFHC) pure copper grade (C10200) in vacuum atmosphere of (1.5 *10-5 mbr.). Mini tab (response surface) was applied for optimiz...

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Autores principales:	Ahmed Ali Akbar Akbar, Sami Abualnoun A Ajeel, Safaa Mohammed Hassoni
Formato:	article
Lenguaje:	EN
Publicado:	Al-Khwarizmi College of Engineering – University of Baghdad 2019
Materias:	Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040
Acceso en línea:	https://doaj.org/article/7cdcdf76c8064d6b9c94c55aa692e286
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spelling	oai:doaj.org-article:7cdcdf76c8064d6b9c94c55aa692e2862021-12-02T03:50:43ZOptimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L10.22153/kej.2018.11.0021818-11712312-0789https://doaj.org/article/7cdcdf76c8064d6b9c94c55aa692e2862019-03-01T00:00:00Zhttp://alkej.uobaghdad.edu.iq/index.php/alkej/article/view/381https://doaj.org/toc/1818-1171https://doaj.org/toc/2312-0789 This work deals with determination of optimum conditions of direct diffusion bonding welding of austenitic stainlesssteel type AISI 304L with Oxygen Free High Conductivity (OFHC) pure copper grade (C10200) in vacuum atmosphere of (1.5 *10-5 mbr.). Mini tab (response surface) was applied for optimizing the influence of diffusion bonding parameters (temperature, time and applied load) on the bonding joints characteristics and the empirical relationship was evaluated which represents the effect of each parameter of the process. The yield strength of diffusion bonded joint was equal to 153 MPa and the efficiency of joint was equal to 66.5% as compared with hard drawn copper. The diffusion zone reveals high microhardness than copper side due to solid solution phase formation of (CuNi). The failure of bonded joints always occurred on the copper side and fracture surface morphologies are characterized by ductile failure mode with dimple structure. Optimum bonding conditions were observed at temperature of 650 ◦C, duration time of 45 min. and the applied stress of 30 MPa. The maximum depth of diffuse copper in stainless steel side was equal 11.80 µm. Ahmed Ali Akbar AkbarSami Abualnoun A AjeelSafaa Mohammed HassoniAl-Khwarizmi College of Engineering – University of BaghdadarticleChemical engineeringTP155-156Engineering (General). Civil engineering (General)TA1-2040ENAl-Khawarizmi Engineering Journal, Vol 14, Iss 2 (2019)
institution	DOAJ
collection	DOAJ
language	EN
topic	Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040
spellingShingle	Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040 Ahmed Ali Akbar Akbar Sami Abualnoun A Ajeel Safaa Mohammed Hassoni Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L
description	This work deals with determination of optimum conditions of direct diffusion bonding welding of austenitic stainlesssteel type AISI 304L with Oxygen Free High Conductivity (OFHC) pure copper grade (C10200) in vacuum atmosphere of (1.5 *10-5 mbr.). Mini tab (response surface) was applied for optimizing the influence of diffusion bonding parameters (temperature, time and applied load) on the bonding joints characteristics and the empirical relationship was evaluated which represents the effect of each parameter of the process. The yield strength of diffusion bonded joint was equal to 153 MPa and the efficiency of joint was equal to 66.5% as compared with hard drawn copper. The diffusion zone reveals high microhardness than copper side due to solid solution phase formation of (CuNi). The failure of bonded joints always occurred on the copper side and fracture surface morphologies are characterized by ductile failure mode with dimple structure. Optimum bonding conditions were observed at temperature of 650 ◦C, duration time of 45 min. and the applied stress of 30 MPa. The maximum depth of diffuse copper in stainless steel side was equal 11.80 µm.
format	article
author	Ahmed Ali Akbar Akbar Sami Abualnoun A Ajeel Safaa Mohammed Hassoni
author_facet	Ahmed Ali Akbar Akbar Sami Abualnoun A Ajeel Safaa Mohammed Hassoni
author_sort	Ahmed Ali Akbar Akbar
title	Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L
title_short	Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L
title_full	Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L
title_fullStr	Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L
title_full_unstemmed	Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L
title_sort	optimization of diffusion bonding of pure copper (ofhc) with stainless steel 304l
publisher	Al-Khwarizmi College of Engineering – University of Baghdad
publishDate	2019
url	https://doaj.org/article/7cdcdf76c8064d6b9c94c55aa692e286
work_keys_str_mv	AT ahmedaliakbarakbar optimizationofdiffusionbondingofpurecopperofhcwithstainlesssteel304l AT samiabualnounaajeel optimizationofdiffusionbondingofpurecopperofhcwithstainlesssteel304l AT safaamohammedhassoni optimizationofdiffusionbondingofpurecopperofhcwithstainlesssteel304l
_version_	1718401604607016960

Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L

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