Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L

This work deals with determination of optimum conditions of direct diffusion bonding welding of austenitic stainlesssteel type AISI 304L with Oxygen Free High Conductivity (OFHC) pure copper grade (C10200) in vacuum atmosphere of (1.5 *10-5 mbr.). Mini tab (response surface) was applied for optimiz...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: Ahmed Ali Akbar Akbar, Sami Abualnoun A Ajeel, Safaa Mohammed Hassoni
Formato: article
Lenguaje:EN
Publicado: Al-Khwarizmi College of Engineering – University of Baghdad 2019
Materias:
Acceso en línea:https://doaj.org/article/7cdcdf76c8064d6b9c94c55aa692e286
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!

Ejemplares similares