Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L

This work deals with determination of optimum conditions of direct diffusion bonding welding of austenitic stainlesssteel type AISI 304L with Oxygen Free High Conductivity (OFHC) pure copper grade (C10200) in vacuum atmosphere of (1.5 *10-5 mbr.). Mini tab (response surface) was applied for optimiz...

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Bibliographic Details
Main Authors: Ahmed Ali Akbar Akbar, Sami Abualnoun A Ajeel, Safaa Mohammed Hassoni
Format: article
Language:EN
Published: Al-Khwarizmi College of Engineering – University of Baghdad 2019
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Online Access:https://doaj.org/article/7cdcdf76c8064d6b9c94c55aa692e286
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