Optimization of Diffusion Bonding of Pure Copper (OFHC) with Stainless Steel 304L
This work deals with determination of optimum conditions of direct diffusion bonding welding of austenitic stainlesssteel type AISI 304L with Oxygen Free High Conductivity (OFHC) pure copper grade (C10200) in vacuum atmosphere of (1.5 *10-5 mbr.). Mini tab (response surface) was applied for optimiz...
Enregistré dans:
Auteurs principaux: | , , |
---|---|
Format: | article |
Langue: | EN |
Publié: |
Al-Khwarizmi College of Engineering – University of Baghdad
2019
|
Sujets: | |
Accès en ligne: | https://doaj.org/article/7cdcdf76c8064d6b9c94c55aa692e286 |
Tags: |
Ajouter un tag
Pas de tags, Soyez le premier à ajouter un tag!
|