Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions

Spider aggregate glue avoids failure in humid environments but the fundamental mechanism behind it is still unknown. Here, the authors demonstrate that humidity-dependent structural changes of glycoproteins and sequestering of liquid water by low molecular mass compounds prevents adhesion failure of...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: Saranshu Singla, Gaurav Amarpuri, Nishad Dhopatkar, Todd A. Blackledge, Ali Dhinojwala
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2018
Materias:
Q
Acceso en línea:https://doaj.org/article/7def7103996c41699235476c7c4d0af9
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
Descripción
Sumario:Spider aggregate glue avoids failure in humid environments but the fundamental mechanism behind it is still unknown. Here, the authors demonstrate that humidity-dependent structural changes of glycoproteins and sequestering of liquid water by low molecular mass compounds prevents adhesion failure of the glue in humid environments.