Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions

Spider aggregate glue avoids failure in humid environments but the fundamental mechanism behind it is still unknown. Here, the authors demonstrate that humidity-dependent structural changes of glycoproteins and sequestering of liquid water by low molecular mass compounds prevents adhesion failure of...

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Autores principales:	Saranshu Singla, Gaurav Amarpuri, Nishad Dhopatkar, Todd A. Blackledge, Ali Dhinojwala
Formato:	article
Lenguaje:	EN
Publicado:	Nature Portfolio 2018
Materias:	Science Q
Acceso en línea:	https://doaj.org/article/7def7103996c41699235476c7c4d0af9
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spelling	oai:doaj.org-article:7def7103996c41699235476c7c4d0af92021-12-02T14:41:05ZHygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions10.1038/s41467-018-04263-z2041-1723https://doaj.org/article/7def7103996c41699235476c7c4d0af92018-05-01T00:00:00Zhttps://doi.org/10.1038/s41467-018-04263-zhttps://doaj.org/toc/2041-1723Spider aggregate glue avoids failure in humid environments but the fundamental mechanism behind it is still unknown. Here, the authors demonstrate that humidity-dependent structural changes of glycoproteins and sequestering of liquid water by low molecular mass compounds prevents adhesion failure of the glue in humid environments.Saranshu SinglaGaurav AmarpuriNishad DhopatkarTodd A. BlackledgeAli DhinojwalaNature PortfolioarticleScienceQENNature Communications, Vol 9, Iss 1, Pp 1-8 (2018)
institution	DOAJ
collection	DOAJ
language	EN
topic	Science Q
spellingShingle	Science Q Saranshu Singla Gaurav Amarpuri Nishad Dhopatkar Todd A. Blackledge Ali Dhinojwala Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions
description	Spider aggregate glue avoids failure in humid environments but the fundamental mechanism behind it is still unknown. Here, the authors demonstrate that humidity-dependent structural changes of glycoproteins and sequestering of liquid water by low molecular mass compounds prevents adhesion failure of the glue in humid environments.
format	article
author	Saranshu Singla Gaurav Amarpuri Nishad Dhopatkar Todd A. Blackledge Ali Dhinojwala
author_facet	Saranshu Singla Gaurav Amarpuri Nishad Dhopatkar Todd A. Blackledge Ali Dhinojwala
author_sort	Saranshu Singla
title	Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions
title_short	Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions
title_full	Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions
title_fullStr	Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions
title_full_unstemmed	Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions
title_sort	hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions
publisher	Nature Portfolio
publishDate	2018
url	https://doaj.org/article/7def7103996c41699235476c7c4d0af9
work_keys_str_mv	AT saranshusingla hygroscopiccompoundsinspideraggregateglueremoveinterfacialwatertomaintainadhesioninhumidconditions AT gauravamarpuri hygroscopiccompoundsinspideraggregateglueremoveinterfacialwatertomaintainadhesioninhumidconditions AT nishaddhopatkar hygroscopiccompoundsinspideraggregateglueremoveinterfacialwatertomaintainadhesioninhumidconditions AT toddablackledge hygroscopiccompoundsinspideraggregateglueremoveinterfacialwatertomaintainadhesioninhumidconditions AT alidhinojwala hygroscopiccompoundsinspideraggregateglueremoveinterfacialwatertomaintainadhesioninhumidconditions
_version_	1718390000702193664

Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions

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