Bonding Mechanism of Cold-Sprayed TiO<sub>2</sub> Coatings on Copper and Aluminum Substrates

Th<b>e</b> cold spraying of ceramic materials is widely acknowledged as a difficult process because it necessitates the feedstock powder particles experiencing a plastic deformation for deposition on a substrate. The problem arises due to the brittle properties of ceramic powder feedstoc...

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Autores principales:	Noor irinah Omar, Motohiro Yamada, Toshiaki Yasui, Masahiro Fukumoto
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	cold spray titanium dioxide adhesion strength bonding mechanism pure copper pure aluminum Engineering (General). Civil engineering (General) TA1-2040
Acceso en línea:	https://doaj.org/article/7ea1d6769eec4df9b2d7eaa271595a00
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spelling	oai:doaj.org-article:7ea1d6769eec4df9b2d7eaa271595a002021-11-25T17:16:21ZBonding Mechanism of Cold-Sprayed TiO<sub>2</sub> Coatings on Copper and Aluminum Substrates10.3390/coatings111113492079-6412https://doaj.org/article/7ea1d6769eec4df9b2d7eaa271595a002021-11-01T00:00:00Zhttps://www.mdpi.com/2079-6412/11/11/1349https://doaj.org/toc/2079-6412Th<b>e</b> cold spraying of ceramic materials is widely acknowledged as a difficult process because it necessitates the feedstock powder particles experiencing a plastic deformation for deposition on a substrate. The problem arises due to the brittle properties of ceramic powder feedstock such as titanium dioxide (TiO<sub>2</sub>), combined with a lack of understanding of the bonding mechanisms. In this study, TiO<sub>2</sub> coatings were deposited onto copper and aluminum substrates and the adhesion strength was evaluated to investigate the bonding mechanism. The influence of substrate hardness and remaining surface oxide layer was investigated by annealing the substrates with various temperatures. The results showed that the adhesion strength of the coatings on the aluminum substrate was higher than the copper substrate. Furthermore, the adhesion strength was decreased with increasing the annealing temperature on both substrate materials. These results indicate that a softer aluminum substrate was advantageous for adhesion. Annealing led to thermal softening the substrate; however, the thickness of the surface oxide layer was increased. Therefore, bonding occurred between the cold-sprayed TiO<sub>2</sub> particle and newly deform substrate surface, which yielded the higher adhesion strength. The main bonding mechanism is metallurgical, similarly to the cold-sprayed metallic coatings.Noor irinah OmarMotohiro YamadaToshiaki YasuiMasahiro FukumotoMDPI AGarticlecold spraytitanium dioxideadhesion strengthbonding mechanismpure copperpure aluminumEngineering (General). Civil engineering (General)TA1-2040ENCoatings, Vol 11, Iss 1349, p 1349 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	cold spray titanium dioxide adhesion strength bonding mechanism pure copper pure aluminum Engineering (General). Civil engineering (General) TA1-2040
spellingShingle	cold spray titanium dioxide adhesion strength bonding mechanism pure copper pure aluminum Engineering (General). Civil engineering (General) TA1-2040 Noor irinah Omar Motohiro Yamada Toshiaki Yasui Masahiro Fukumoto Bonding Mechanism of Cold-Sprayed TiO<sub>2</sub> Coatings on Copper and Aluminum Substrates
description	Th<b>e</b> cold spraying of ceramic materials is widely acknowledged as a difficult process because it necessitates the feedstock powder particles experiencing a plastic deformation for deposition on a substrate. The problem arises due to the brittle properties of ceramic powder feedstock such as titanium dioxide (TiO<sub>2</sub>), combined with a lack of understanding of the bonding mechanisms. In this study, TiO<sub>2</sub> coatings were deposited onto copper and aluminum substrates and the adhesion strength was evaluated to investigate the bonding mechanism. The influence of substrate hardness and remaining surface oxide layer was investigated by annealing the substrates with various temperatures. The results showed that the adhesion strength of the coatings on the aluminum substrate was higher than the copper substrate. Furthermore, the adhesion strength was decreased with increasing the annealing temperature on both substrate materials. These results indicate that a softer aluminum substrate was advantageous for adhesion. Annealing led to thermal softening the substrate; however, the thickness of the surface oxide layer was increased. Therefore, bonding occurred between the cold-sprayed TiO<sub>2</sub> particle and newly deform substrate surface, which yielded the higher adhesion strength. The main bonding mechanism is metallurgical, similarly to the cold-sprayed metallic coatings.
format	article
author	Noor irinah Omar Motohiro Yamada Toshiaki Yasui Masahiro Fukumoto
author_facet	Noor irinah Omar Motohiro Yamada Toshiaki Yasui Masahiro Fukumoto
author_sort	Noor irinah Omar
title	Bonding Mechanism of Cold-Sprayed TiO<sub>2</sub> Coatings on Copper and Aluminum Substrates
title_short	Bonding Mechanism of Cold-Sprayed TiO<sub>2</sub> Coatings on Copper and Aluminum Substrates
title_full	Bonding Mechanism of Cold-Sprayed TiO<sub>2</sub> Coatings on Copper and Aluminum Substrates
title_fullStr	Bonding Mechanism of Cold-Sprayed TiO<sub>2</sub> Coatings on Copper and Aluminum Substrates
title_full_unstemmed	Bonding Mechanism of Cold-Sprayed TiO<sub>2</sub> Coatings on Copper and Aluminum Substrates
title_sort	bonding mechanism of cold-sprayed tio<sub>2</sub> coatings on copper and aluminum substrates
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/7ea1d6769eec4df9b2d7eaa271595a00
work_keys_str_mv	AT nooririnahomar bondingmechanismofcoldsprayedtiosub2subcoatingsoncopperandaluminumsubstrates AT motohiroyamada bondingmechanismofcoldsprayedtiosub2subcoatingsoncopperandaluminumsubstrates AT toshiakiyasui bondingmechanismofcoldsprayedtiosub2subcoatingsoncopperandaluminumsubstrates AT masahirofukumoto bondingmechanismofcoldsprayedtiosub2subcoatingsoncopperandaluminumsubstrates
_version_	1718412540486090752

Bonding Mechanism of Cold-Sprayed TiO<sub>2</sub> Coatings on Copper and Aluminum Substrates

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