Szcesny, M., Heieck, F., Carosella, S., Middendorf, P., Sehrschön, H., & Schneiderbauer, M. (2017). The advanced ply placement process – an innovative direct 3D placement technology for plies and tapes. Taylor & Francis Group.
Cita Chicago Style (17a ed.)Szcesny, Marko, Frieder Heieck, Stefan Carosella, Peter Middendorf, Harald Sehrschön, y Michael Schneiderbauer. The Advanced Ply Placement Process – an Innovative Direct 3D Placement Technology for Plies and Tapes. Taylor & Francis Group, 2017.
Cita MLA (8a ed.)Szcesny, Marko, et al. The Advanced Ply Placement Process – an Innovative Direct 3D Placement Technology for Plies and Tapes. Taylor & Francis Group, 2017.
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