Fabrication, Microstructure, and Properties of In Situ V<sub>2</sub>C-Reinforced Copper Composites
In this paper, in situ V<sub>2</sub>C-reinforced Cu composites were successfully fabricated by hot pressing at 750 °C under 25 MPa using Cu and V<sub>2</sub>SnC powders. Due to decomposition of V<sub>2</sub>SnC to V<sub>2</sub>C and Sn during sintering...
Guardado en:
| Autores principales: | , , , , , , , |
|---|---|
| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
MDPI AG
2021
|
| Materias: | |
| Acceso en línea: | https://doaj.org/article/812412fb719d4dce9a82bcd1b1dea675 |
| Etiquetas: |
Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
| Sumario: | In this paper, in situ V<sub>2</sub>C-reinforced Cu composites were successfully fabricated by hot pressing at 750 °C under 25 MPa using Cu and V<sub>2</sub>SnC powders. Due to decomposition of V<sub>2</sub>SnC to V<sub>2</sub>C and Sn during sintering, Sn atoms entered the crystal structure of Cu. Therefore, final compositions of composites consisted of Cu(Sn) and V<sub>2</sub>C phases. Here, copper composites with 0, 5, 10, 20, and 30 vol.% V<sub>2</sub>C were designed. Their microstructures and physical and mechanical properties were systematically investigated. It was observed that with increasing V<sub>2</sub>C content, electrical conductivity decreased from 0.589 × 10<sup>8</sup> S·m<sup>−1</sup> to 0.034 × 10<sup>8</sup> S·m<sup>−1</sup> and thermal conductivity decreased from 384.36 W⋅m<sup>−1</sup>⋅K<sup>−1</sup> to 24.65 W·m<sup>−1</sup>·K<sup>−1</sup>, while Vickers hardness increased from 52.6 HV to 334 HV. Furthermore, it was found that composites with 20 vol.% V<sub>2</sub>C had the highest tensile strength (440 MPa). |
|---|