Molecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper

Abstract The paper presents results of a large-scale classical molecular dynamics study into the effect of ingrain defects on the grain growth rate of face centered cubic nanocrystalline material under thermal annealing. To do this, two types of virtual MD samples are used. The samples of the first...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: Vladimir V. Dremov, Pavel V. Chirkov, Alexey V. Karavaev
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2021
Materias:
R
Q
Acceso en línea:https://doaj.org/article/8169302ff30c46929938559f44868f82
Etiquetas: Agregar Etiqueta
Sin Etiquetas, Sea el primero en etiquetar este registro!
id oai:doaj.org-article:8169302ff30c46929938559f44868f82
record_format dspace
spelling oai:doaj.org-article:8169302ff30c46929938559f44868f822021-12-02T14:12:08ZMolecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper10.1038/s41598-020-79861-32045-2322https://doaj.org/article/8169302ff30c46929938559f44868f822021-01-01T00:00:00Zhttps://doi.org/10.1038/s41598-020-79861-3https://doaj.org/toc/2045-2322Abstract The paper presents results of a large-scale classical molecular dynamics study into the effect of ingrain defects on the grain growth rate of face centered cubic nanocrystalline material under thermal annealing. To do this, two types of virtual MD samples are used. The samples of the first type are constructed artificially by filling Voronoi cells with atoms arranged in fcc lattice essentially with no ingrain defects. The other samples are obtained by natural crystallization from melted material and contain numerous extended ingrain defects. These samples with a high concentration of ingrain defects imitate nanocrystalline material produced by severe plastic deformation via high pressure torsion or equal channel angular extrusion. The samples of both types are subjected to long-time zero pressure isothermal annealing at $$T\approx 0.9T_m$$ T ≈ 0.9 T m ( $$T_m$$ T m is melting temperature) which leads to grain coarsening due to recrystallization. Direct molecular dynamics simulations of the annealing of different samples show that at the same conditions recrystallization goes two times faster in the samples with a high concentration of extended ingrain defects than in the defect-free samples. That is, to increase the thermal stability of nanostructured material the technologies used for forming nanocrystalline structures should be developed so as to avoid the thermomechanical treatment regimes leading to the formation of structures with high concentration of ingrain defects.Vladimir V. DremovPavel V. ChirkovAlexey V. KaravaevNature PortfolioarticleMedicineRScienceQENScientific Reports, Vol 11, Iss 1, Pp 1-9 (2021)
institution DOAJ
collection DOAJ
language EN
topic Medicine
R
Science
Q
spellingShingle Medicine
R
Science
Q
Vladimir V. Dremov
Pavel V. Chirkov
Alexey V. Karavaev
Molecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper
description Abstract The paper presents results of a large-scale classical molecular dynamics study into the effect of ingrain defects on the grain growth rate of face centered cubic nanocrystalline material under thermal annealing. To do this, two types of virtual MD samples are used. The samples of the first type are constructed artificially by filling Voronoi cells with atoms arranged in fcc lattice essentially with no ingrain defects. The other samples are obtained by natural crystallization from melted material and contain numerous extended ingrain defects. These samples with a high concentration of ingrain defects imitate nanocrystalline material produced by severe plastic deformation via high pressure torsion or equal channel angular extrusion. The samples of both types are subjected to long-time zero pressure isothermal annealing at $$T\approx 0.9T_m$$ T ≈ 0.9 T m ( $$T_m$$ T m is melting temperature) which leads to grain coarsening due to recrystallization. Direct molecular dynamics simulations of the annealing of different samples show that at the same conditions recrystallization goes two times faster in the samples with a high concentration of extended ingrain defects than in the defect-free samples. That is, to increase the thermal stability of nanostructured material the technologies used for forming nanocrystalline structures should be developed so as to avoid the thermomechanical treatment regimes leading to the formation of structures with high concentration of ingrain defects.
format article
author Vladimir V. Dremov
Pavel V. Chirkov
Alexey V. Karavaev
author_facet Vladimir V. Dremov
Pavel V. Chirkov
Alexey V. Karavaev
author_sort Vladimir V. Dremov
title Molecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper
title_short Molecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper
title_full Molecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper
title_fullStr Molecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper
title_full_unstemmed Molecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper
title_sort molecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper
publisher Nature Portfolio
publishDate 2021
url https://doaj.org/article/8169302ff30c46929938559f44868f82
work_keys_str_mv AT vladimirvdremov moleculardynamicsstudyoftheeffectofextendedingraindefectsongraingrowthkineticsinnanocrystallinecopper
AT pavelvchirkov moleculardynamicsstudyoftheeffectofextendedingraindefectsongraingrowthkineticsinnanocrystallinecopper
AT alexeyvkaravaev moleculardynamicsstudyoftheeffectofextendedingraindefectsongraingrowthkineticsinnanocrystallinecopper
_version_ 1718391854037204992