Influence of Carbon Nanowalls Interlayer on Copper Deposition

This research deals with the deposition of copper on a steel substrate. Two different methods were investigated: electrochemical and magnetron sputtering. The deposition parameters were optimized to obtain a coating layer with uniform granular structure and good adhesion to the substrate. As a novel...

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Autores principales: Cristiana-Alexandra Danes, Cristina Dumitriu, Sorin Vizireanu, Bogdan Bita, Ioana-Maria Nicola, Gheorghe Dinescu, Cristian Pirvu
Formato: article
Lenguaje:EN
Publicado: MDPI AG 2021
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Acceso en línea:https://doaj.org/article/8402c86602814bfbbee6ed2724b2d9dc
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