Influence of Carbon Nanowalls Interlayer on Copper Deposition
This research deals with the deposition of copper on a steel substrate. Two different methods were investigated: electrochemical and magnetron sputtering. The deposition parameters were optimized to obtain a coating layer with uniform granular structure and good adhesion to the substrate. As a novel...
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| Autores principales: | , , , , , , |
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| Formato: | article |
| Lenguaje: | EN |
| Publicado: |
MDPI AG
2021
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| Materias: | |
| Acceso en línea: | https://doaj.org/article/8402c86602814bfbbee6ed2724b2d9dc |
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