Development of a New Temporary Attachment Technique for Detecting Debonding of a Composite Structure Using Impedance Based Non-Destructive Testing Method

To date, the application of composite materials has been used throughout the globe due to its advantages, such as corrosion resistance, high strength, design flexibility, and light weight. However, the joining of composite materials is usually achieved with adhesives, where debonding of parts can ca...

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Autores principales:	Dong-Woo Seo, Kyu-San Jung, Yi-Seul Kim, Hyung-Jin Kim, Wongi S. Na
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	piezoelectric transducer non-destructive testing debonding composite materials damage detection Technology T Engineering (General). Civil engineering (General) TA1-2040 Biology (General) QH301-705.5 Physics QC1-999 Chemistry QD1-999
Acceso en línea:	https://doaj.org/article/8418172dc9fa4373903ff3ebb160ce4c
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spelling	oai:doaj.org-article:8418172dc9fa4373903ff3ebb160ce4c2021-11-25T16:37:34ZDevelopment of a New Temporary Attachment Technique for Detecting Debonding of a Composite Structure Using Impedance Based Non-Destructive Testing Method10.3390/app1122107632076-3417https://doaj.org/article/8418172dc9fa4373903ff3ebb160ce4c2021-11-01T00:00:00Zhttps://www.mdpi.com/2076-3417/11/22/10763https://doaj.org/toc/2076-3417To date, the application of composite materials has been used throughout the globe due to its advantages, such as corrosion resistance, high strength, design flexibility, and light weight. However, the joining of composite materials is usually achieved with adhesives, where debonding of parts can cause unexpected failure. Thus, detecting and locating defects due to impact or fatigue stresses at an early stage is crucial to ensure safety. Various non-destructive testing (NDT) techniques have been used to detect defects in composite structures, where this study proposes an improved approach of using one of the NDT techniques to detect and locate debonding of glass fiber epoxy plates. Here, the electromechanical impedance (EMI) technique is used with a new way of detecting defects using a movable device. This idea could reduce the overall cost of the monitoring system as the conventional EMI technique requires one to permanently attach a large number of piezoelectric transducers when monitoring large structures. The performance of the proposed idea is tested against another temporary attachment method to investigate the possibility of using the new idea for monitoring debonding in composite structures.Dong-Woo SeoKyu-San JungYi-Seul KimHyung-Jin KimWongi S. NaMDPI AGarticlepiezoelectric transducernon-destructive testingdebondingcomposite materialsdamage detectionTechnologyTEngineering (General). Civil engineering (General)TA1-2040Biology (General)QH301-705.5PhysicsQC1-999ChemistryQD1-999ENApplied Sciences, Vol 11, Iss 10763, p 10763 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	piezoelectric transducer non-destructive testing debonding composite materials damage detection Technology T Engineering (General). Civil engineering (General) TA1-2040 Biology (General) QH301-705.5 Physics QC1-999 Chemistry QD1-999
spellingShingle	piezoelectric transducer non-destructive testing debonding composite materials damage detection Technology T Engineering (General). Civil engineering (General) TA1-2040 Biology (General) QH301-705.5 Physics QC1-999 Chemistry QD1-999 Dong-Woo Seo Kyu-San Jung Yi-Seul Kim Hyung-Jin Kim Wongi S. Na Development of a New Temporary Attachment Technique for Detecting Debonding of a Composite Structure Using Impedance Based Non-Destructive Testing Method
description	To date, the application of composite materials has been used throughout the globe due to its advantages, such as corrosion resistance, high strength, design flexibility, and light weight. However, the joining of composite materials is usually achieved with adhesives, where debonding of parts can cause unexpected failure. Thus, detecting and locating defects due to impact or fatigue stresses at an early stage is crucial to ensure safety. Various non-destructive testing (NDT) techniques have been used to detect defects in composite structures, where this study proposes an improved approach of using one of the NDT techniques to detect and locate debonding of glass fiber epoxy plates. Here, the electromechanical impedance (EMI) technique is used with a new way of detecting defects using a movable device. This idea could reduce the overall cost of the monitoring system as the conventional EMI technique requires one to permanently attach a large number of piezoelectric transducers when monitoring large structures. The performance of the proposed idea is tested against another temporary attachment method to investigate the possibility of using the new idea for monitoring debonding in composite structures.
format	article
author	Dong-Woo Seo Kyu-San Jung Yi-Seul Kim Hyung-Jin Kim Wongi S. Na
author_facet	Dong-Woo Seo Kyu-San Jung Yi-Seul Kim Hyung-Jin Kim Wongi S. Na
author_sort	Dong-Woo Seo
title	Development of a New Temporary Attachment Technique for Detecting Debonding of a Composite Structure Using Impedance Based Non-Destructive Testing Method
title_short	Development of a New Temporary Attachment Technique for Detecting Debonding of a Composite Structure Using Impedance Based Non-Destructive Testing Method
title_full	Development of a New Temporary Attachment Technique for Detecting Debonding of a Composite Structure Using Impedance Based Non-Destructive Testing Method
title_fullStr	Development of a New Temporary Attachment Technique for Detecting Debonding of a Composite Structure Using Impedance Based Non-Destructive Testing Method
title_full_unstemmed	Development of a New Temporary Attachment Technique for Detecting Debonding of a Composite Structure Using Impedance Based Non-Destructive Testing Method
title_sort	development of a new temporary attachment technique for detecting debonding of a composite structure using impedance based non-destructive testing method
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/8418172dc9fa4373903ff3ebb160ce4c
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Development of a New Temporary Attachment Technique for Detecting Debonding of a Composite Structure Using Impedance Based Non-Destructive Testing Method

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