Densification of pure copper by selective laser melting process

Pure copper is utilized as a material for products with complicated shape and high thermal conductivity such as heat exchangers. However, it is difficult to fabricate pure copper parts with high density by the selective laser melting (SLM) process. One of the reasons is considered to be its high the...

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Autores principales:	Ken IMAI, Toshi-Taka IKESHOJI, Yuji SUGITANI, Hideki KYOGOKU
Formato:	article
Lenguaje:	EN
Publicado:	The Japan Society of Mechanical Engineers 2020
Materias:	additive manufacturing process parameter copper density microstructure Mechanical engineering and machinery TJ1-1570
Acceso en línea:	https://doaj.org/article/8718bf68b8ea4babbf050a91e3d136eb
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id	oai:doaj.org-article:8718bf68b8ea4babbf050a91e3d136eb
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spelling	oai:doaj.org-article:8718bf68b8ea4babbf050a91e3d136eb2021-11-29T05:53:24ZDensification of pure copper by selective laser melting process2187-974510.1299/mej.19-00272https://doaj.org/article/8718bf68b8ea4babbf050a91e3d136eb2020-03-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/mej/7/2/7_19-00272/_pdf/-char/enhttps://doaj.org/toc/2187-9745Pure copper is utilized as a material for products with complicated shape and high thermal conductivity such as heat exchangers. However, it is difficult to fabricate pure copper parts with high density by the selective laser melting (SLM) process. One of the reasons is considered to be its high thermal conductivity by which the heat in the melt pool rapidly diffuses away. Additionally, the lower rate of energy absorption of fiber laser power for pure copper makes the size of melt pool smaller. In this research, the optimum fabrication condition of high-purity 99.9% copper fabricated by SLM process was investigated by evaluating the density and microstructure. As a result, it was found that the optimum condition of laser power and scan speed are 800~900W and 300 mm/s, respectively, and the optimum energy density is around 1000 J/mm3, which is much higher than that of other materials due to high reflectivity and high thermal conductivity of pure copper. And also, it was found that the hatch pitch is important factor to achieve the densification of the as-built specimen and the optimum hatch pitch was 0.01 mm. The high density parts were successfully fabricated by the optimum fabrication condition. The maximum density of the as-built specimen was 96.6 % and was much higher than that of the as-built part already reported.Ken IMAIToshi-Taka IKESHOJIYuji SUGITANIHideki KYOGOKUThe Japan Society of Mechanical Engineersarticleadditive manufacturingprocess parametercopperdensitymicrostructureMechanical engineering and machineryTJ1-1570ENMechanical Engineering Journal, Vol 7, Iss 2, Pp 19-00272-19-00272 (2020)
institution	DOAJ
collection	DOAJ
language	EN
topic	additive manufacturing process parameter copper density microstructure Mechanical engineering and machinery TJ1-1570
spellingShingle	additive manufacturing process parameter copper density microstructure Mechanical engineering and machinery TJ1-1570 Ken IMAI Toshi-Taka IKESHOJI Yuji SUGITANI Hideki KYOGOKU Densification of pure copper by selective laser melting process
description	Pure copper is utilized as a material for products with complicated shape and high thermal conductivity such as heat exchangers. However, it is difficult to fabricate pure copper parts with high density by the selective laser melting (SLM) process. One of the reasons is considered to be its high thermal conductivity by which the heat in the melt pool rapidly diffuses away. Additionally, the lower rate of energy absorption of fiber laser power for pure copper makes the size of melt pool smaller. In this research, the optimum fabrication condition of high-purity 99.9% copper fabricated by SLM process was investigated by evaluating the density and microstructure. As a result, it was found that the optimum condition of laser power and scan speed are 800~900W and 300 mm/s, respectively, and the optimum energy density is around 1000 J/mm3, which is much higher than that of other materials due to high reflectivity and high thermal conductivity of pure copper. And also, it was found that the hatch pitch is important factor to achieve the densification of the as-built specimen and the optimum hatch pitch was 0.01 mm. The high density parts were successfully fabricated by the optimum fabrication condition. The maximum density of the as-built specimen was 96.6 % and was much higher than that of the as-built part already reported.
format	article
author	Ken IMAI Toshi-Taka IKESHOJI Yuji SUGITANI Hideki KYOGOKU
author_facet	Ken IMAI Toshi-Taka IKESHOJI Yuji SUGITANI Hideki KYOGOKU
author_sort	Ken IMAI
title	Densification of pure copper by selective laser melting process
title_short	Densification of pure copper by selective laser melting process
title_full	Densification of pure copper by selective laser melting process
title_fullStr	Densification of pure copper by selective laser melting process
title_full_unstemmed	Densification of pure copper by selective laser melting process
title_sort	densification of pure copper by selective laser melting process
publisher	The Japan Society of Mechanical Engineers
publishDate	2020
url	https://doaj.org/article/8718bf68b8ea4babbf050a91e3d136eb
work_keys_str_mv	AT kenimai densificationofpurecopperbyselectivelasermeltingprocess AT toshitakaikeshoji densificationofpurecopperbyselectivelasermeltingprocess AT yujisugitani densificationofpurecopperbyselectivelasermeltingprocess AT hidekikyogoku densificationofpurecopperbyselectivelasermeltingprocess
_version_	1718407598166769664

Densification of pure copper by selective laser melting process

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