High-strength vacuum diffusion bonding of Cu-plated, sandblasted W and CuCrZr alloy
W/CuCrZr alloy composite panels are promising plasma-facing components for use in future nuclear-fusion reactors. However, the intrinsic immiscibility of W and Cu makes joining them difficult. In this study, we developed a vacuum diffusion bonding method that involves sandblasting of the W substrate...
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2021
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oai:doaj.org-article:88ebe3e11b4b46608e545eee71836d812021-12-02T05:01:46ZHigh-strength vacuum diffusion bonding of Cu-plated, sandblasted W and CuCrZr alloy2238-785410.1016/j.jmrt.2021.11.069https://doaj.org/article/88ebe3e11b4b46608e545eee71836d812021-11-01T00:00:00Zhttp://www.sciencedirect.com/science/article/pii/S223878542101348Xhttps://doaj.org/toc/2238-7854W/CuCrZr alloy composite panels are promising plasma-facing components for use in future nuclear-fusion reactors. However, the intrinsic immiscibility of W and Cu makes joining them difficult. In this study, we developed a vacuum diffusion bonding method that involves sandblasting of the W substrate surface, Cu electroplating and annealing, and subsequent vacuum diffusion bonding to realize W/CuCrZr joints with high bond strength. The morphologies and structures of the W and W/CuCrZr joints were investigated by scanning electron microscopy, X-ray diffraction, and high-resolution transmission electron microscopy. Sandblasting was found to induce the plastic deformation, roughening, and grain refinement of the W substrate surface. During Cu plating on the surface of the sandblasted W (and subsequent annealing), the Cu layer was embedded in micron-scale irregular pits on the sandblasted W surface, creating a tight bond. The shear bond strength (184 MPa) and bonding quality of a W/CuCrZr joint obtained with the sandblasting/Cu interlayer method was superior to those of a W/CuCrZr joint prepared by conventional vacuum diffusion bonding. The structural origins of this superior W/CuCrZr joint were related to a region of W and Cu interdiffusion with a thickness of approximately 30 nm. This improved vacuum diffusion bonding method for W and CuCrZr can facilitate the development of plasma-facing components for future nuclear-fusion devices.Yuanyuan ChenYuan HuangLu HanDongguang LiuLaima LuoChong LiChenxi LiuZumin WangElsevierarticleWCuCrZrVacuum diffusion bondingSandblastingCu platingPlasma-facing componentsMining engineering. MetallurgyTN1-997ENJournal of Materials Research and Technology, Vol 15, Iss , Pp 6260-6271 (2021) |
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W CuCrZr Vacuum diffusion bonding Sandblasting Cu plating Plasma-facing components Mining engineering. Metallurgy TN1-997 |
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W CuCrZr Vacuum diffusion bonding Sandblasting Cu plating Plasma-facing components Mining engineering. Metallurgy TN1-997 Yuanyuan Chen Yuan Huang Lu Han Dongguang Liu Laima Luo Chong Li Chenxi Liu Zumin Wang High-strength vacuum diffusion bonding of Cu-plated, sandblasted W and CuCrZr alloy |
description |
W/CuCrZr alloy composite panels are promising plasma-facing components for use in future nuclear-fusion reactors. However, the intrinsic immiscibility of W and Cu makes joining them difficult. In this study, we developed a vacuum diffusion bonding method that involves sandblasting of the W substrate surface, Cu electroplating and annealing, and subsequent vacuum diffusion bonding to realize W/CuCrZr joints with high bond strength. The morphologies and structures of the W and W/CuCrZr joints were investigated by scanning electron microscopy, X-ray diffraction, and high-resolution transmission electron microscopy. Sandblasting was found to induce the plastic deformation, roughening, and grain refinement of the W substrate surface. During Cu plating on the surface of the sandblasted W (and subsequent annealing), the Cu layer was embedded in micron-scale irregular pits on the sandblasted W surface, creating a tight bond. The shear bond strength (184 MPa) and bonding quality of a W/CuCrZr joint obtained with the sandblasting/Cu interlayer method was superior to those of a W/CuCrZr joint prepared by conventional vacuum diffusion bonding. The structural origins of this superior W/CuCrZr joint were related to a region of W and Cu interdiffusion with a thickness of approximately 30 nm. This improved vacuum diffusion bonding method for W and CuCrZr can facilitate the development of plasma-facing components for future nuclear-fusion devices. |
format |
article |
author |
Yuanyuan Chen Yuan Huang Lu Han Dongguang Liu Laima Luo Chong Li Chenxi Liu Zumin Wang |
author_facet |
Yuanyuan Chen Yuan Huang Lu Han Dongguang Liu Laima Luo Chong Li Chenxi Liu Zumin Wang |
author_sort |
Yuanyuan Chen |
title |
High-strength vacuum diffusion bonding of Cu-plated, sandblasted W and CuCrZr alloy |
title_short |
High-strength vacuum diffusion bonding of Cu-plated, sandblasted W and CuCrZr alloy |
title_full |
High-strength vacuum diffusion bonding of Cu-plated, sandblasted W and CuCrZr alloy |
title_fullStr |
High-strength vacuum diffusion bonding of Cu-plated, sandblasted W and CuCrZr alloy |
title_full_unstemmed |
High-strength vacuum diffusion bonding of Cu-plated, sandblasted W and CuCrZr alloy |
title_sort |
high-strength vacuum diffusion bonding of cu-plated, sandblasted w and cucrzr alloy |
publisher |
Elsevier |
publishDate |
2021 |
url |
https://doaj.org/article/88ebe3e11b4b46608e545eee71836d81 |
work_keys_str_mv |
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_version_ |
1718400776067350528 |