Finite element analysis of springback behavior in resistance heating assisted microbending process

By assisting with resistance heating, the material formability can be improved, and more homogeneous material flow can be obtained. In this study, finite element (FE) models for an analysis of microbending process assisted by resistance heating were developed. Coupled thermal-electrical procedure an...

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Autores principales:	Qiu ZHENG, Tetsuhide SHIMIZU, Ming YANG
Formato:	article
Lenguaje:	EN
Publicado:	The Japan Society of Mechanical Engineers 2015
Materias:	microbending resistance heating elevated temperature springback finite element (fe) analysis Mechanical engineering and machinery TJ1-1570
Acceso en línea:	https://doaj.org/article/8a24476f82b747b1803127451be06d1c
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spelling	oai:doaj.org-article:8a24476f82b747b1803127451be06d1c2021-11-26T06:16:58ZFinite element analysis of springback behavior in resistance heating assisted microbending process2187-974510.1299/mej.14-00413https://doaj.org/article/8a24476f82b747b1803127451be06d1c2015-01-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/mej/2/1/2_14-00413/_pdf/-char/enhttps://doaj.org/toc/2187-9745By assisting with resistance heating, the material formability can be improved, and more homogeneous material flow can be obtained. In this study, finite element (FE) models for an analysis of microbending process assisted by resistance heating were developed. Coupled thermal-electrical procedure and coupled thermal-displacement dynamic explicit procedure were conducted to analyze the temperature distribution and material deformation, respectively. And static implicit procedure was carried out for the analysis of springback behavior. The simulation results show that the temperature distribution of the blank is caused by the difference in electrical current density, which influences the material deformation as well as springback behavior. And the spingback angle decreases with increasing forming temperature. The temperature distribution and springback angle obtained from the simulation show the same tendency with the experiments, which confirmed the feasibility of the developed FE models. By using the developed FE models, the effects of the temperature distribution on material behavior can be obtained, and the springback angle for microbending process assisted by resistance heating can be predicted precisely. The possibility of reducing springback and improving the accuracy of the products by designing the process efficiently is demonstrated.Qiu ZHENGTetsuhide SHIMIZUMing YANGThe Japan Society of Mechanical Engineersarticlemicrobendingresistance heatingelevated temperaturespringbackfinite element (fe) analysisMechanical engineering and machineryTJ1-1570ENMechanical Engineering Journal, Vol 2, Iss 1, Pp 14-00413-14-00413 (2015)
institution	DOAJ
collection	DOAJ
language	EN
topic	microbending resistance heating elevated temperature springback finite element (fe) analysis Mechanical engineering and machinery TJ1-1570
spellingShingle	microbending resistance heating elevated temperature springback finite element (fe) analysis Mechanical engineering and machinery TJ1-1570 Qiu ZHENG Tetsuhide SHIMIZU Ming YANG Finite element analysis of springback behavior in resistance heating assisted microbending process
description	By assisting with resistance heating, the material formability can be improved, and more homogeneous material flow can be obtained. In this study, finite element (FE) models for an analysis of microbending process assisted by resistance heating were developed. Coupled thermal-electrical procedure and coupled thermal-displacement dynamic explicit procedure were conducted to analyze the temperature distribution and material deformation, respectively. And static implicit procedure was carried out for the analysis of springback behavior. The simulation results show that the temperature distribution of the blank is caused by the difference in electrical current density, which influences the material deformation as well as springback behavior. And the spingback angle decreases with increasing forming temperature. The temperature distribution and springback angle obtained from the simulation show the same tendency with the experiments, which confirmed the feasibility of the developed FE models. By using the developed FE models, the effects of the temperature distribution on material behavior can be obtained, and the springback angle for microbending process assisted by resistance heating can be predicted precisely. The possibility of reducing springback and improving the accuracy of the products by designing the process efficiently is demonstrated.
format	article
author	Qiu ZHENG Tetsuhide SHIMIZU Ming YANG
author_facet	Qiu ZHENG Tetsuhide SHIMIZU Ming YANG
author_sort	Qiu ZHENG
title	Finite element analysis of springback behavior in resistance heating assisted microbending process
title_short	Finite element analysis of springback behavior in resistance heating assisted microbending process
title_full	Finite element analysis of springback behavior in resistance heating assisted microbending process
title_fullStr	Finite element analysis of springback behavior in resistance heating assisted microbending process
title_full_unstemmed	Finite element analysis of springback behavior in resistance heating assisted microbending process
title_sort	finite element analysis of springback behavior in resistance heating assisted microbending process
publisher	The Japan Society of Mechanical Engineers
publishDate	2015
url	https://doaj.org/article/8a24476f82b747b1803127451be06d1c
work_keys_str_mv	AT qiuzheng finiteelementanalysisofspringbackbehaviorinresistanceheatingassistedmicrobendingprocess AT tetsuhideshimizu finiteelementanalysisofspringbackbehaviorinresistanceheatingassistedmicrobendingprocess AT mingyang finiteelementanalysisofspringbackbehaviorinresistanceheatingassistedmicrobendingprocess
_version_	1718409790122622976

Finite element analysis of springback behavior in resistance heating assisted microbending process

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