Cita APA (7a ed.)

Liu, Y., Peng, Y., & Qu, X. (2021). Mechanism of and Key Technologies for Copper Bonding in the Hot Rolling of SCR Continuous Casting and Rolling. MDPI AG.

Cita Chicago Style (17a ed.)

Liu, Yang, Yan Peng, y Xiaobo Qu. Mechanism of and Key Technologies for Copper Bonding in the Hot Rolling of SCR Continuous Casting and Rolling. MDPI AG, 2021.

Cita MLA (8a ed.)

Liu, Yang, et al. Mechanism of and Key Technologies for Copper Bonding in the Hot Rolling of SCR Continuous Casting and Rolling. MDPI AG, 2021.

Precaución: Estas citas no son 100% exactas.