Liu, Y., Peng, Y., & Qu, X. (2021). Mechanism of and Key Technologies for Copper Bonding in the Hot Rolling of SCR Continuous Casting and Rolling. MDPI AG.
Chicago Style (17th ed.) CitationLiu, Yang, Yan Peng, and Xiaobo Qu. Mechanism of and Key Technologies for Copper Bonding in the Hot Rolling of SCR Continuous Casting and Rolling. MDPI AG, 2021.
MLA (8th ed.) CitationLiu, Yang, et al. Mechanism of and Key Technologies for Copper Bonding in the Hot Rolling of SCR Continuous Casting and Rolling. MDPI AG, 2021.
Warning: These citations may not always be 100% accurate.