Liu, Y., Peng, Y., & Qu, X. (2021). Mechanism of and Key Technologies for Copper Bonding in the Hot Rolling of SCR Continuous Casting and Rolling. MDPI AG.
Style de citation Chicago (17e éd.)Liu, Yang, Yan Peng, et Xiaobo Qu. Mechanism of and Key Technologies for Copper Bonding in the Hot Rolling of SCR Continuous Casting and Rolling. MDPI AG, 2021.
Style de citation MLA (8e éd.)Liu, Yang, et al. Mechanism of and Key Technologies for Copper Bonding in the Hot Rolling of SCR Continuous Casting and Rolling. MDPI AG, 2021.
Attention : ces citations peuvent ne pas être correctes à 100%.