Improvement of properties of silver filled epoxy composites via processing method

Conductive composites consisting of an epoxy matrix and silver flakes were fabricated, and mechanical, thermal and electric properties were investigated as a function of particle concentration and processing techniques. Scanning electron microscope (SEM) was utilized in an attempt to study the effec...

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Autores principales:	Mariatti, M., Azizan, A.
Formato:	article
Lenguaje:	EN
Publicado:	D.Ghitu Institute of Electronic Engineering and Nanotechnologies 2012
Materias:	Physics QC1-999 Electronics TK7800-8360
Acceso en línea:	https://doaj.org/article/8b85e4e2b59e4fe8b7470326829ccaa4
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spelling	oai:doaj.org-article:8b85e4e2b59e4fe8b7470326829ccaa42021-11-21T12:01:44Z Improvement of properties of silver filled epoxy composites via processing method2537-63651810-648Xhttps://doaj.org/article/8b85e4e2b59e4fe8b7470326829ccaa42012-01-01T00:00:00Zhttps://mjps.nanotech.md/archive/2012/article/18998https://doaj.org/toc/1810-648Xhttps://doaj.org/toc/2537-6365Conductive composites consisting of an epoxy matrix and silver flakes were fabricated, and mechanical, thermal and electric properties were investigated as a function of particle concentration and processing techniques. Scanning electron microscope (SEM) was utilized in an attempt to study the effect of the processing method on the distribution of silver flakes in the matrix. As observed by SEM, the use of a homogenizer enhanced the distribution of silver flakes with reducing the particle agglomeration due to the presence of shear force during mixing. The application of shear mixing during the fabrication of conductive polymer composites increased the electric conductivity, flexural modulus, and storage modulus of the silver filled epoxy composite.Mariatti, M.Azizan, A.D.Ghitu Institute of Electronic Engineering and NanotechnologiesarticlePhysicsQC1-999ElectronicsTK7800-8360ENMoldavian Journal of the Physical Sciences, Vol 11, Iss 1-2, Pp 94-105 (2012)
institution	DOAJ
collection	DOAJ
language	EN
topic	Physics QC1-999 Electronics TK7800-8360
spellingShingle	Physics QC1-999 Electronics TK7800-8360 Mariatti, M. Azizan, A. Improvement of properties of silver filled epoxy composites via processing method
description	Conductive composites consisting of an epoxy matrix and silver flakes were fabricated, and mechanical, thermal and electric properties were investigated as a function of particle concentration and processing techniques. Scanning electron microscope (SEM) was utilized in an attempt to study the effect of the processing method on the distribution of silver flakes in the matrix. As observed by SEM, the use of a homogenizer enhanced the distribution of silver flakes with reducing the particle agglomeration due to the presence of shear force during mixing. The application of shear mixing during the fabrication of conductive polymer composites increased the electric conductivity, flexural modulus, and storage modulus of the silver filled epoxy composite.
format	article
author	Mariatti, M. Azizan, A.
author_facet	Mariatti, M. Azizan, A.
author_sort	Mariatti, M.
title	Improvement of properties of silver filled epoxy composites via processing method
title_short	Improvement of properties of silver filled epoxy composites via processing method
title_full	Improvement of properties of silver filled epoxy composites via processing method
title_fullStr	Improvement of properties of silver filled epoxy composites via processing method
title_full_unstemmed	Improvement of properties of silver filled epoxy composites via processing method
title_sort	improvement of properties of silver filled epoxy composites via processing method
publisher	D.Ghitu Institute of Electronic Engineering and Nanotechnologies
publishDate	2012
url	https://doaj.org/article/8b85e4e2b59e4fe8b7470326829ccaa4
work_keys_str_mv	AT mariattim improvementofpropertiesofsilverfilledepoxycompositesviaprocessingmethod AT azizana improvementofpropertiesofsilverfilledepoxycompositesviaprocessingmethod
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Improvement of properties of silver filled epoxy composites via processing method

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