Depth Profile Analysis of the Modified Layer of Poly(vinyltrimethylsilane) Films Treated by Direct-Current Discharge

Previously, we found that modification of the membrane surface from polyvinyltrimethylsilane (PVTMS) by treatment with low-temperature plasma induced by low pressure DC discharge leads to a significant increase in gas separation characteristics. To understand the mechanism of this phenomenon, in thi...

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Autores principales:	Mikhail Piskarev, Elena Skryleva, Alla Gilman, Boris Senatulin, Alexander Zinoviev, Daria Syrtsova, Vladimir Teplyakov, Alexander Kuznetsov
Formato:	article
Lenguaje:	EN
Publicado:	MDPI AG 2021
Materias:	poly(vinyltrimethylsilane) film direct current discharge modification X-ray photoelectron spectroscopy precision etching argon gas cluster ion beams (GCIB) depth profile analysis Engineering (General). Civil engineering (General) TA1-2040
Acceso en línea:	https://doaj.org/article/8e9c8bdcad994cddbcb723297434c100
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spelling	oai:doaj.org-article:8e9c8bdcad994cddbcb723297434c1002021-11-25T17:15:58ZDepth Profile Analysis of the Modified Layer of Poly(vinyltrimethylsilane) Films Treated by Direct-Current Discharge10.3390/coatings111113172079-6412https://doaj.org/article/8e9c8bdcad994cddbcb723297434c1002021-10-01T00:00:00Zhttps://www.mdpi.com/2079-6412/11/11/1317https://doaj.org/toc/2079-6412Previously, we found that modification of the membrane surface from polyvinyltrimethylsilane (PVTMS) by treatment with low-temperature plasma induced by low pressure DC discharge leads to a significant increase in gas separation characteristics. To understand the mechanism of this phenomenon, in this article XPS combined with precision etching 10 keV beam of Ar<sub>2500</sub><sup>+</sup> clusters was used for depth profiling of PVTMS spin-coated films before and after DC discharge treatment. The etching craters depths were measured by stylus surface profiler. The average etching rate of the untreated PVTMS film by Ar<sub>2500</sub><sup>+</sup> clusters was defined (230 nm/min). It was found that the low temperature plasma treatment of PVTMS leads to a sharp increase in the oxygen concentration on a surface with a simultaneous decrease in the carbon content. The experimental data obtained indicate also that the treatment of PVTMS film by plasma leads not only to a change in the chemical structure of the surface, but also to the formation of a gradient subsurface layer with a thickness of about 50 nm.Mikhail PiskarevElena SkrylevaAlla GilmanBoris SenatulinAlexander ZinovievDaria SyrtsovaVladimir TeplyakovAlexander KuznetsovMDPI AGarticlepoly(vinyltrimethylsilane) filmdirect current discharge modificationX-ray photoelectron spectroscopyprecision etchingargon gas cluster ion beams (GCIB)depth profile analysisEngineering (General). Civil engineering (General)TA1-2040ENCoatings, Vol 11, Iss 1317, p 1317 (2021)
institution	DOAJ
collection	DOAJ
language	EN
topic	poly(vinyltrimethylsilane) film direct current discharge modification X-ray photoelectron spectroscopy precision etching argon gas cluster ion beams (GCIB) depth profile analysis Engineering (General). Civil engineering (General) TA1-2040
spellingShingle	poly(vinyltrimethylsilane) film direct current discharge modification X-ray photoelectron spectroscopy precision etching argon gas cluster ion beams (GCIB) depth profile analysis Engineering (General). Civil engineering (General) TA1-2040 Mikhail Piskarev Elena Skryleva Alla Gilman Boris Senatulin Alexander Zinoviev Daria Syrtsova Vladimir Teplyakov Alexander Kuznetsov Depth Profile Analysis of the Modified Layer of Poly(vinyltrimethylsilane) Films Treated by Direct-Current Discharge
description	Previously, we found that modification of the membrane surface from polyvinyltrimethylsilane (PVTMS) by treatment with low-temperature plasma induced by low pressure DC discharge leads to a significant increase in gas separation characteristics. To understand the mechanism of this phenomenon, in this article XPS combined with precision etching 10 keV beam of Ar<sub>2500</sub><sup>+</sup> clusters was used for depth profiling of PVTMS spin-coated films before and after DC discharge treatment. The etching craters depths were measured by stylus surface profiler. The average etching rate of the untreated PVTMS film by Ar<sub>2500</sub><sup>+</sup> clusters was defined (230 nm/min). It was found that the low temperature plasma treatment of PVTMS leads to a sharp increase in the oxygen concentration on a surface with a simultaneous decrease in the carbon content. The experimental data obtained indicate also that the treatment of PVTMS film by plasma leads not only to a change in the chemical structure of the surface, but also to the formation of a gradient subsurface layer with a thickness of about 50 nm.
format	article
author	Mikhail Piskarev Elena Skryleva Alla Gilman Boris Senatulin Alexander Zinoviev Daria Syrtsova Vladimir Teplyakov Alexander Kuznetsov
author_facet	Mikhail Piskarev Elena Skryleva Alla Gilman Boris Senatulin Alexander Zinoviev Daria Syrtsova Vladimir Teplyakov Alexander Kuznetsov
author_sort	Mikhail Piskarev
title	Depth Profile Analysis of the Modified Layer of Poly(vinyltrimethylsilane) Films Treated by Direct-Current Discharge
title_short	Depth Profile Analysis of the Modified Layer of Poly(vinyltrimethylsilane) Films Treated by Direct-Current Discharge
title_full	Depth Profile Analysis of the Modified Layer of Poly(vinyltrimethylsilane) Films Treated by Direct-Current Discharge
title_fullStr	Depth Profile Analysis of the Modified Layer of Poly(vinyltrimethylsilane) Films Treated by Direct-Current Discharge
title_full_unstemmed	Depth Profile Analysis of the Modified Layer of Poly(vinyltrimethylsilane) Films Treated by Direct-Current Discharge
title_sort	depth profile analysis of the modified layer of poly(vinyltrimethylsilane) films treated by direct-current discharge
publisher	MDPI AG
publishDate	2021
url	https://doaj.org/article/8e9c8bdcad994cddbcb723297434c100
work_keys_str_mv	AT mikhailpiskarev depthprofileanalysisofthemodifiedlayerofpolyvinyltrimethylsilanefilmstreatedbydirectcurrentdischarge AT elenaskryleva depthprofileanalysisofthemodifiedlayerofpolyvinyltrimethylsilanefilmstreatedbydirectcurrentdischarge AT allagilman depthprofileanalysisofthemodifiedlayerofpolyvinyltrimethylsilanefilmstreatedbydirectcurrentdischarge AT borissenatulin depthprofileanalysisofthemodifiedlayerofpolyvinyltrimethylsilanefilmstreatedbydirectcurrentdischarge AT alexanderzinoviev depthprofileanalysisofthemodifiedlayerofpolyvinyltrimethylsilanefilmstreatedbydirectcurrentdischarge AT dariasyrtsova depthprofileanalysisofthemodifiedlayerofpolyvinyltrimethylsilanefilmstreatedbydirectcurrentdischarge AT vladimirteplyakov depthprofileanalysisofthemodifiedlayerofpolyvinyltrimethylsilanefilmstreatedbydirectcurrentdischarge AT alexanderkuznetsov depthprofileanalysisofthemodifiedlayerofpolyvinyltrimethylsilanefilmstreatedbydirectcurrentdischarge
_version_	1718412544107872256

Depth Profile Analysis of the Modified Layer of Poly(vinyltrimethylsilane) Films Treated by Direct-Current Discharge

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