An advanced III-V-on-silicon photonic integration platform

In many application scenarios, silicon (Si) photonics favors the integration of III-V gain material onto Si substrate to realize the on-chip light source. In addition to the current popular integration approaches of III-V-on-Si wafer bonding or direct heteroepitaxial growth, a newly emerged promisin...

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Autores principales: Yingtao Hu, Di Liang, Raymond G. Beausoleil
Formato: article
Lenguaje:EN
Publicado: Institue of Optics and Electronics, Chinese Academy of Sciences 2021
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Acceso en línea:https://doaj.org/article/9b955c7e81a74ddd924c0827f4c89960
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