The Behavior of Cement-Bonded Particleboard with Modified Composition under Static Load Stress

This article presents research on the behavior of cement-bonded particleboards under mechanical stress caused by the static load. The composition of the boards was modified using alternative raw materials–dust (DU) forming during the processing of cement-fibre boards and particle mixture (PM) genera...

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Autores principales: Tomas Melichar, Jiri Bydzovsky, Richard Dvorak, Libor Topolar, Sarka Keprdova
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Lenguaje:EN
Publicado: MDPI AG 2021
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spelling oai:doaj.org-article:9c1f793a8f474c6f8866d1594035b9df2021-11-25T18:13:34ZThe Behavior of Cement-Bonded Particleboard with Modified Composition under Static Load Stress10.3390/ma142267881996-1944https://doaj.org/article/9c1f793a8f474c6f8866d1594035b9df2021-11-01T00:00:00Zhttps://www.mdpi.com/1996-1944/14/22/6788https://doaj.org/toc/1996-1944This article presents research on the behavior of cement-bonded particleboards under mechanical stress caused by the static load. The composition of the boards was modified using alternative raw materials–dust (DU) forming during the processing of cement-fibre boards and particle mixture (PM) generated in the production of cement-bonded particleboards. The particleboards (1-year-old) were subjected to an adverse environment (100 to 250 frost cycles). Mechanical parameters were tested, and the development of defects during static load of the boards by bending was analyzed using acoustic emission. Particleboards with modified compositions are slightly more resistant to adverse environments. The results of the acoustic emission showed the different types of defects occurring under stress by bending. Standard-composition particleboards showed defects located mainly under the cylindrical stress-test head. The modified boards showed larger location distribution of the occurring defects that were also concentrated further away from the cylindrical stress head. The energy during the occurrence of defects was higher in the modified boards in the location of weight application than in the reference boards.Tomas MelicharJiri BydzovskyRichard DvorakLibor TopolarSarka KeprdovaMDPI AGarticlecement-bonded particleboardmodificationcompositionadverse environmentfroststressTechnologyTElectrical engineering. Electronics. Nuclear engineeringTK1-9971Engineering (General). Civil engineering (General)TA1-2040MicroscopyQH201-278.5Descriptive and experimental mechanicsQC120-168.85ENMaterials, Vol 14, Iss 6788, p 6788 (2021)
institution DOAJ
collection DOAJ
language EN
topic cement-bonded particleboard
modification
composition
adverse environment
frost
stress
Technology
T
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
Engineering (General). Civil engineering (General)
TA1-2040
Microscopy
QH201-278.5
Descriptive and experimental mechanics
QC120-168.85
spellingShingle cement-bonded particleboard
modification
composition
adverse environment
frost
stress
Technology
T
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
Engineering (General). Civil engineering (General)
TA1-2040
Microscopy
QH201-278.5
Descriptive and experimental mechanics
QC120-168.85
Tomas Melichar
Jiri Bydzovsky
Richard Dvorak
Libor Topolar
Sarka Keprdova
The Behavior of Cement-Bonded Particleboard with Modified Composition under Static Load Stress
description This article presents research on the behavior of cement-bonded particleboards under mechanical stress caused by the static load. The composition of the boards was modified using alternative raw materials–dust (DU) forming during the processing of cement-fibre boards and particle mixture (PM) generated in the production of cement-bonded particleboards. The particleboards (1-year-old) were subjected to an adverse environment (100 to 250 frost cycles). Mechanical parameters were tested, and the development of defects during static load of the boards by bending was analyzed using acoustic emission. Particleboards with modified compositions are slightly more resistant to adverse environments. The results of the acoustic emission showed the different types of defects occurring under stress by bending. Standard-composition particleboards showed defects located mainly under the cylindrical stress-test head. The modified boards showed larger location distribution of the occurring defects that were also concentrated further away from the cylindrical stress head. The energy during the occurrence of defects was higher in the modified boards in the location of weight application than in the reference boards.
format article
author Tomas Melichar
Jiri Bydzovsky
Richard Dvorak
Libor Topolar
Sarka Keprdova
author_facet Tomas Melichar
Jiri Bydzovsky
Richard Dvorak
Libor Topolar
Sarka Keprdova
author_sort Tomas Melichar
title The Behavior of Cement-Bonded Particleboard with Modified Composition under Static Load Stress
title_short The Behavior of Cement-Bonded Particleboard with Modified Composition under Static Load Stress
title_full The Behavior of Cement-Bonded Particleboard with Modified Composition under Static Load Stress
title_fullStr The Behavior of Cement-Bonded Particleboard with Modified Composition under Static Load Stress
title_full_unstemmed The Behavior of Cement-Bonded Particleboard with Modified Composition under Static Load Stress
title_sort behavior of cement-bonded particleboard with modified composition under static load stress
publisher MDPI AG
publishDate 2021
url https://doaj.org/article/9c1f793a8f474c6f8866d1594035b9df
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