Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits

Abstract This study investigates the mechanical compression properties of tin-lead and lead-free alloy spherical balls, using more than 500 samples to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare the aging effect on the microstr...

Descripción completa

Guardado en:

Detalles Bibliográficos
Autor principal:	Alaa Hasan Ali
Formato:	article
Lenguaje:	EN
Publicado:	Al-Khwarizmi College of Engineering – University of Baghdad 2017
Materias:	Keywords: Lead-free solder, composite solder, and aging. Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040
Acceso en línea:	https://doaj.org/article/a0531174ae3f48b2a2013bd63454a2ee
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

id	oai:doaj.org-article:a0531174ae3f48b2a2013bd63454a2ee
record_format	dspace
spelling	oai:doaj.org-article:a0531174ae3f48b2a2013bd63454a2ee2021-12-02T05:52:08ZComparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits1818-11712312-0789https://doaj.org/article/a0531174ae3f48b2a2013bd63454a2ee2017-12-01T00:00:00Zhttp://alkej.uobaghdad.edu.iq/index.php/alkej/article/view/197https://doaj.org/toc/1818-1171https://doaj.org/toc/2312-0789 Abstract This study investigates the mechanical compression properties of tin-lead and lead-free alloy spherical balls, using more than 500 samples to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare the aging effect on the microstructure and properties. The results showed significant elastic and plastic anisotropy of tin phase in lead-free tin based solder and that was compared with simulation using a Crystal Plasticity Finite Element (CPEF) method that has the anisotropy of Sn installed. The results and experiments were in good agreement, indicating the range of values expected with anisotropic properties. Keywords: Lead-free solder, composite solder, and aging. Alaa Hasan AliAl-Khwarizmi College of Engineering – University of BaghdadarticleKeywords: Lead-free solder, composite solder, and aging.Chemical engineeringTP155-156Engineering (General). Civil engineering (General)TA1-2040ENAl-Khawarizmi Engineering Journal, Vol 10, Iss 2 (2017)
institution	DOAJ
collection	DOAJ
language	EN
topic	Keywords: Lead-free solder, composite solder, and aging. Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040
spellingShingle	Keywords: Lead-free solder, composite solder, and aging. Chemical engineering TP155-156 Engineering (General). Civil engineering (General) TA1-2040 Alaa Hasan Ali Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
description	Abstract This study investigates the mechanical compression properties of tin-lead and lead-free alloy spherical balls, using more than 500 samples to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare the aging effect on the microstructure and properties. The results showed significant elastic and plastic anisotropy of tin phase in lead-free tin based solder and that was compared with simulation using a Crystal Plasticity Finite Element (CPEF) method that has the anisotropy of Sn installed. The results and experiments were in good agreement, indicating the range of values expected with anisotropic properties. Keywords: Lead-free solder, composite solder, and aging.
format	article
author	Alaa Hasan Ali
author_facet	Alaa Hasan Ali
author_sort	Alaa Hasan Ali
title	Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
title_short	Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
title_full	Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
title_fullStr	Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
title_full_unstemmed	Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
title_sort	comparisons of mechanical properties of sub-mm lead based and lead free based solder using in manufacturing of printed circuits
publisher	Al-Khwarizmi College of Engineering – University of Baghdad
publishDate	2017
url	https://doaj.org/article/a0531174ae3f48b2a2013bd63454a2ee
work_keys_str_mv	AT alaahasanali comparisonsofmechanicalpropertiesofsubmmleadbasedandleadfreebasedsolderusinginmanufacturingofprintedcircuits
_version_	1718400186891370496

Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits

Ejemplares similares