Comparisons of Mechanical Properties of sub-mm Lead Based and Lead Free Based Solder Using in Manufacturing of Printed Circuits
Abstract This study investigates the mechanical compression properties of tin-lead and lead-free alloy spherical balls, using more than 500 samples to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare the aging effect on the microstr...
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| Formato: | article |
| Lenguaje: | EN |
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Al-Khwarizmi College of Engineering – University of Baghdad
2017
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| Acceso en línea: | https://doaj.org/article/a0531174ae3f48b2a2013bd63454a2ee |
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