Non-destructive observations of small crack using scanning laser-induced acoustic microscope

The scanning laser-induced acoustic microscope (SLAM) has been developed as a tool for non-destructive observations of the defects in materials. It consists of the laser with modulation system, the function generator, the lock-in amplifier, the AE sensor which detects the longitudinal acoustic waves...

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Autores principales:	Atsuhiro KOYAMA, Toru TAKASE, Fumitaka MOTOMURA, Hiroki KOGA, Satoshi RYU, Yoji SHIBUTANI
Formato:	article
Lenguaje:	EN
Publicado:	The Japan Society of Mechanical Engineers 2016
Materias:	scanning laser-induced acoustic microscope non-destructive observation crack thermal stress wave acoustic wave Mechanical engineering and machinery TJ1-1570
Acceso en línea:	https://doaj.org/article/a0c701d5d5244bb8a6bc2cdb77ca3d06
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spelling	oai:doaj.org-article:a0c701d5d5244bb8a6bc2cdb77ca3d062021-11-26T06:58:32ZNon-destructive observations of small crack using scanning laser-induced acoustic microscope2187-974510.1299/mej.16-00147https://doaj.org/article/a0c701d5d5244bb8a6bc2cdb77ca3d062016-08-01T00:00:00Zhttps://www.jstage.jst.go.jp/article/mej/3/6/3_16-00147/_pdf/-char/enhttps://doaj.org/toc/2187-9745The scanning laser-induced acoustic microscope (SLAM) has been developed as a tool for non-destructive observations of the defects in materials. It consists of the laser with modulation system, the function generator, the lock-in amplifier, the AE sensor which detects the longitudinal acoustic waves, the XY stage and a computer for signal processing. The cyclic chopping laser beam causes the thermal wave. Our own-built SLAM has successfully provided some nondestructive observations; the bonding boundary of the different materials and the small crack in the materials. Since the SLAM senses the local difference of thermal properties in the sample, it performs observing the boundary or the crack well. The scanning laser-induced acoustic image (LAI) is affected by the power and chopping frequency of the laser. We revealed that the laser power more than a certain value (105 mW) is required in order to obtain a clear LAI with our SLAM in the case of the observation of aluminum alloy. Moreover, the LAI is affected by the chopping frequency of the laser and the LAI becomes clearer as the chopping frequency becomes higher even if the chopping frequency is up to 15 kHz which is relatively low.Atsuhiro KOYAMAToru TAKASEFumitaka MOTOMURAHiroki KOGASatoshi RYUYoji SHIBUTANIThe Japan Society of Mechanical Engineersarticlescanning laser-induced acoustic microscopenon-destructive observationcrackthermal stress waveacoustic waveMechanical engineering and machineryTJ1-1570ENMechanical Engineering Journal, Vol 3, Iss 6, Pp 16-00147-16-00147 (2016)
institution	DOAJ
collection	DOAJ
language	EN
topic	scanning laser-induced acoustic microscope non-destructive observation crack thermal stress wave acoustic wave Mechanical engineering and machinery TJ1-1570
spellingShingle	scanning laser-induced acoustic microscope non-destructive observation crack thermal stress wave acoustic wave Mechanical engineering and machinery TJ1-1570 Atsuhiro KOYAMA Toru TAKASE Fumitaka MOTOMURA Hiroki KOGA Satoshi RYU Yoji SHIBUTANI Non-destructive observations of small crack using scanning laser-induced acoustic microscope
description	The scanning laser-induced acoustic microscope (SLAM) has been developed as a tool for non-destructive observations of the defects in materials. It consists of the laser with modulation system, the function generator, the lock-in amplifier, the AE sensor which detects the longitudinal acoustic waves, the XY stage and a computer for signal processing. The cyclic chopping laser beam causes the thermal wave. Our own-built SLAM has successfully provided some nondestructive observations; the bonding boundary of the different materials and the small crack in the materials. Since the SLAM senses the local difference of thermal properties in the sample, it performs observing the boundary or the crack well. The scanning laser-induced acoustic image (LAI) is affected by the power and chopping frequency of the laser. We revealed that the laser power more than a certain value (105 mW) is required in order to obtain a clear LAI with our SLAM in the case of the observation of aluminum alloy. Moreover, the LAI is affected by the chopping frequency of the laser and the LAI becomes clearer as the chopping frequency becomes higher even if the chopping frequency is up to 15 kHz which is relatively low.
format	article
author	Atsuhiro KOYAMA Toru TAKASE Fumitaka MOTOMURA Hiroki KOGA Satoshi RYU Yoji SHIBUTANI
author_facet	Atsuhiro KOYAMA Toru TAKASE Fumitaka MOTOMURA Hiroki KOGA Satoshi RYU Yoji SHIBUTANI
author_sort	Atsuhiro KOYAMA
title	Non-destructive observations of small crack using scanning laser-induced acoustic microscope
title_short	Non-destructive observations of small crack using scanning laser-induced acoustic microscope
title_full	Non-destructive observations of small crack using scanning laser-induced acoustic microscope
title_fullStr	Non-destructive observations of small crack using scanning laser-induced acoustic microscope
title_full_unstemmed	Non-destructive observations of small crack using scanning laser-induced acoustic microscope
title_sort	non-destructive observations of small crack using scanning laser-induced acoustic microscope
publisher	The Japan Society of Mechanical Engineers
publishDate	2016
url	https://doaj.org/article/a0c701d5d5244bb8a6bc2cdb77ca3d06
work_keys_str_mv	AT atsuhirokoyama nondestructiveobservationsofsmallcrackusingscanninglaserinducedacousticmicroscope AT torutakase nondestructiveobservationsofsmallcrackusingscanninglaserinducedacousticmicroscope AT fumitakamotomura nondestructiveobservationsofsmallcrackusingscanninglaserinducedacousticmicroscope AT hirokikoga nondestructiveobservationsofsmallcrackusingscanninglaserinducedacousticmicroscope AT satoshiryu nondestructiveobservationsofsmallcrackusingscanninglaserinducedacousticmicroscope AT yojishibutani nondestructiveobservationsofsmallcrackusingscanninglaserinducedacousticmicroscope
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Non-destructive observations of small crack using scanning laser-induced acoustic microscope

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