Efficient strain modulation of 2D materials via polymer encapsulation

Efficient strain modulation of 2D materials via polymer encapsulation

Strain engineering is a promising method to manipulate properties of two-dimensional (2D) materials but slippage between material and substrate makes strain transfer inefficient. Here the authors overcome slipping effects by encapsulating a 2D material in a polymer substrate.

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Detalles Bibliográficos
Autores principales: Zhiwei Li, Yawei Lv, Liwang Ren, Jia Li, Lingan Kong, Yujia Zeng, Quanyang Tao, Ruixia Wu, Huifang Ma, Bei Zhao, Di Wang, Weiqi Dang, Keqiu Chen, Lei Liao, Xidong Duan, Xiangfeng Duan, Yuan Liu
Formato: article
Lenguaje:EN
Publicado: Nature Portfolio 2020
Materias:
Science
Q
Acceso en línea:https://doaj.org/article/a4692fe73abb4502a04fc02b5498025b
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